XCKU3P-1SFVB784I - 256-I/O Kintex UltraScale+ FPGA | AMD
料号： XCKU3P-1SFVB784I ✓ 量产中XCKU3P-1SFVB784I 概述
A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, interfaces, and processing blocks are configured after manufacture. An FPGA sits above basic programmable logic and fixed-function microcontrollers in the hardware hierarchy: configuration software creates a dedicated digital circuit from the FPGA’s configurable logic blocks, block RAM, DSP resources, high-speed I/O, and clocking resources. This makes an FPGA suitable when deterministic parallel processing, flexible interfaces, or field-updatable logic are more important than the simplicity of a microcontroller.
The XCKU3P family is positioned for high-end signal-processing and connectivity designs. AMD describes Kintex UltraScale+ devices around a balance of performance, power, memory-interface capability, high-speed connectivity, and cost efficiency. The catalog listing for XCKU3P-1SFVB784I identifies 256 I/O and the 784-BFBGA FCBGA package. Exact logic-cell, memory, transceiver, speed-grade, and electrical details must be confirmed against the device-specific AMD documentation before final design release.
The “1” ordering suffix identifies the performance class used for this ordering code, while “SFVB784” identifies the package configuration. The final “I” denotes the industrial-temperature ordering option. Package construction is important for this device because a 784-ball FCBGA requires controlled board assembly, a multilayer PCB, appropriate via and escape routing, and careful power-delivery design to support the FPGA’s high pin count and performance requirements.
Typical uses include industrial control and automation, high-speed data acquisition, communications infrastructure, instrumentation, embedded processing, and prototyping systems requiring programmable logic. The 256-I/O interface supports external memory, transceivers, clocks, and application-specific peripherals when the selected device resources and speed grades support those interfaces.
Designers should preserve the exact SFVB784 footprint, verify every power rail and decoupling requirement in the AMD pinout and package documentation, and confirm that the selected configuration scheme matches the board’s boot architecture. Device migration also requires checking logical-cell usage, RAM, DSP, transceiver resources, pin constraints, timing closure, and the exact I/O standard rather than relying only on package similarity.
This product record combines the exact XCKU3P-1SFVB784I catalog identity, package and I/O information, available manufacturer resources, same-family drop-in candidates, and practical implementation guidance. It is intended to accelerate engineering evaluation while keeping footprint, configuration, thermal, and signal-integrity verification tied to the official AMD documentation.
直接替换替代料： XCKU3P-1SFVB784I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： XCKU3P-1SFVB784I （相同外形与封装尺寸） ——差异在于 Package, Package Type, Temperature Grade, Speed Grade, Device Family.
XCKU3P-L1SFVB784I
✅ 直接替换📋 参考替代料（不在目录中）
XCKU3P-L2SFVB784E
✅ 直接替换📋 参考替代料（不在目录中）
XCKU3P-1SFVB784E
✅ 直接替换 ⚠️ 规格未核验联系询价
查看数据手册 →XCKU3P-2SFVB784I
✅ 直接替换 ⚠️ 规格未核验联系询价
查看数据手册 →XCKU3P-2SFVB784E
✅ 直接替换 ⚠️ 规格未核验联系询价
查看数据手册 →XCKU3P-1SFVB784I 最大额定值与电气特性
| Product Type | Kintex UltraScale+ FPGA |
| Device Family | XCKU3P |
| Product Type | Field-programmable gate array (FPGA) |
| I/O Count | 256 I/O |
| Package Type | 784-ball FCBGA |
| Package Designation | 784-BFBGA |
| 安装类型 | Surface mount |
| Ordering Suffix | 1SFVB784I |
| Performance Grade | 1 |
| Temperature Grade | Industrial (I) |
XCKU3P-1SFVB784I 784-bfbga 引脚配置指南
XCKU3P-1SFVB784I（784-bfbga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： XCKU3P-1SFVB784I.
请参阅 数据手册 以查看完整引脚配置。
典型应用
XCKU3P-1SFVB784I 适用于 6 应用s: Industrial Automation and Control, High-Speed Data Acquisition, Communications Infrastructure, Embedded Test and Measurement, Video and Imaging Systems, Aerospace and Defense Prototyping.
Industrial Automation and Control
The XCKU3P-1SFVB784I fits high-end industrial automation controllers that combine deterministic parallel logic with numerous field-bus, sensor, actuator, and communication interfaces. Its 256 I/O provide a substantial external connectivity footprint, while the Kintex UltraScale+ architecture supports the programmable logic, memory, DSP, and high-speed I/O resources needed for complex control functions. The industrial ordering suffix makes the part a logical starting point for factory equipment, but the design must verify the exact operating-temperature limits, supported I/O standards, power rails, and reliability requirements. Configuration should use the AMD device, package, and reference-design guidance for the SFVB784 footprint.
推荐
High-Speed Data Acquisition
XCKU3P-1SFVB784I is appropriate for parallel data-acquisition systems that must ingest multiple channels, perform real-time filtering, and transfer processed results through high-speed interfaces. The 256-I/O count supports dense connections to converters, memory devices, clocks, and custom peripherals, while the Kintex UltraScale+ device family provides configurable logic, block memory, and DSP resources for acquisition pipelines. Engineers should map every signal to the SFVB784 package file and confirm that the selected I/O standards, timing classes, voltage levels, and board channel lengths are supported. Power integrity and return-path planning are especially important because wide parallel buses can amplify skew, crosstalk, and simultaneous-switching noise.
推荐
Communications Infrastructure
The XCKU3P-1SFVB784I can serve as the programmable fabric in communications equipment requiring high-throughput logic, flexible interfaces, and scalable digital processing. AMD positions Kintex UltraScale+ devices for high-end connectivity and memory-interface workloads, making the family relevant to protocol conversion, packet processing, clocking, and interface aggregation systems. The 784-BFBGA package provides many physical balls for high-speed routing and power delivery, but it also requires a sophisticated multilayer PCB and disciplined signal-integrity design. The final implementation should confirm transceiver or I/O availability, supported line rates, reference-clock requirements, configuration mode, and thermal performance against the exact device data.
推荐
Embedded Test and Measurement
XCKU3P-1SFVB784I fits modular instrumentation and automated test equipment that combine acquisition, pattern generation, timing control, analysis, and communications in one programmable platform. Its 256 I/O allow dense connections to converters, counters, relays, memories, and external clock sources, while the XCKU3P architecture allows the digital measurement path to be adapted after manufacture. Using the manufacturer’s package and reference-design guidance reduces risk in a 784-ball FCBGA design with many simultaneous switching nets. Before hardware release, validate timing margins, I/O voltage standards, pin constraints, configuration storage, synchronization architecture, and resource utilization for the intended test sequence.
推荐
Video and Imaging Systems
The XCKU3P-1SFVB784I is suitable for image-processing and video systems requiring parallel pixel data handling, configurable logic, DSP capability, and high-speed external connectivity. The 256-I/O device can support camera or sensor interfaces, line buffers, memory interfaces, and downstream processing when the selected UltraScale+ resources meet the throughput target. A 784-ball FCBGA also enables dense routing among memory, logic, and I/O, although careful via planning and return-path continuity are essential. Engineers should determine whether dedicated hardware blocks or general I/O are appropriate, confirm supported video-interface IP through AMD tools, and complete timing, power, thermal, and PCB signal-integrity analysis before production.
推荐
Aerospace and Defense Prototyping
XCKU3P-1SFVB784I can support advanced programmable-logic prototypes in aerospace, defense, and space systems that need configurable digital processing, extensive I/O, and long-lived program flexibility. The Kintex UltraScale+ architecture is suitable for signal generation, telemetry processing, control logic, and data-routing functions when its exact resources and environmental ratings satisfy the mission profile. The SFVB784 package places the design on a high-density board platform, requiring approved assembly processes, controlled materials, and detailed thermal verification. Before adoption, check the precise temperature range, screening options, radiation-related requirements, export controls, documentation, configuration security, and lifecycle expectations directly with AMD.
推荐
推荐产品汇总
工程参考数据： XCKU3P-1SFVB784I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XCKU3P-L1SFVB784I | XCKU3P-L2SFVB784E | XCKU3P-1SFVB784E | XCKU3P-2SFVB784I | XCKU3P-2SFVB784E |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 784-BFBGA FCBGA | 784-BFBGA FCBGA - same package | 784-BFBGA FCBGA - same package | 784-BFBGA FCBGA - same package | 784-BFBGA FCBGA - same package | 784-BFBGA FCBGA - same package |
| Device Family | Kintex UltraScale+ XCKU3P | Kintex UltraScale+ XCKU3P | Kintex UltraScale+ XCKU3P | Kintex UltraScale+ XCKU3P | Kintex UltraScale+ XCKU3P | Kintex UltraScale+ XCKU3P |
| Performance Ordering Grade | 1 | L1 | L2 | 1 | 2 | 2 |
| Temperature Suffix | I | I | E | E | I | E |
关键差异点
- Exact target ordering configuration （对比 XCKU3P-L1SFVB784I)
- Industrial temperature suffix retained （对比 XCKU3P-1SFVB784E)
- Performance-grade ordering continuity （对比 XCKU3P-2SFVB784I)
- Same-package XCKU3P migration path （对比 XCKU3P-L2SFVB784E)
设计说明
Design the SFVB784 footprint directly from AMD’s official package files and reference schematics. A 784-ball FCBGA demands a multilayer PCB, short power-plane connections, dense via escaping, and carefully controlled solder-mask and land geometry. Do not infer pad locations from another BGA package: even when the ball count is similar, package families can use different ball maps and keep-out regions.
Use the device-specific power-decoupling and plane-connection instructions rather than generic BGA practice. Separate noisy, sensitive, and general-purpose supply distributions where the AMD design calls for it, provide local bulk and high-frequency decoupling at each supply ball group, and verify voltage sequencing against the configuration method. Power-plane resistance and simultaneous switching current must be checked with the actual board stack-up and device activity profile.
Route the 256 external I/O connections with continuous reference planes and avoid crossing plane splits. Match length where the selected interface requires it, control impedance according to the PCB fabricator, and keep high-speed clocks and data away from noisy power-regulator switching nodes. Because the exact supported I/O standards and timing grades are device-specific, validate every pin and interface through AMD pin constraints and timing analysis.
Thermal design should include the board copper available to the FCBGA, internal plane dissipation, adjacent heat sources, airflow, and the selected SFVB784 package’s specified thermal metrics. The 784-ball package can distribute power across many connections, but actual junction temperature still depends on placement, stack-up, and enclosure conditions. Perform thermal analysis at the highest expected utilization rather than an idle operating condition.
A matching package does not make every ordering code an automatic substitute. Review the complete AMD ordering guide for the 1, 2, L1, I, and E segments, then verify device resources, speed, temperature, power, configuration, and lifecycle status. Also check whether a design utilizes package balls differently in different XCKU3P options; this can alter routing requirements even when the mechanical footprint is shared.
合规信息
The device is associated with the AMD Kintex UltraScale+ product family. No component-level RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statement was identified in the catalog records, so each status remains unknown.
