XCKU5P-1FFVA676E - 256 I/O Kintex UltraScale+ | AMD
部品番号: XCKU5P-1FFVA676E ✓ 生産中XCKU5P-1FFVA676E 概要
A field-programmable gate array, or FPGA, is a reconfigurable semiconductor in which digital logic, block memory, signal processing, and programmable I/O are organized into programmable architecture. Within the semiconductor hierarchy, an FPGA belongs to the programmable-logic device class and combines parallel programmable logic fabric with configurable peripherals. This makes the XCKU5P family suitable when design flexibility, parallel processing, high-speed interfaces, and deterministic hardware operation must coexist in one device.
The XCKU5P-1FFVA676E provides 256 I/O in a 676-FCBGA package, giving a board designer access to a substantial pin count for external memory, high-speed serial links, clocks, data acquisition, control interfaces, and general-purpose digital logic. Its catalog figures of 41,984,000 logic cells and 474,600 logic registers describe the density of its programmable architecture, while the Kintex UltraScale+ platform provides resources for demanding parallel-processing and signal-processing designs.
The FFVA676E device is associated with the AMD Kintex UltraScale+ product generation and supports an integrated combination of programmable logic and dedicated hardware resources. Designers can allocate logic for control paths, implement parallel algorithms in fabric, use dedicated resources for DSP-style arithmetic, and map high-speed interfaces according to the device architecture. Exact clock, transceiver, memory, power, and I/O standards should be confirmed against the current AMD data sheet before schematic signoff.
Typical applications include high-throughput signal processing, industrial imaging, radar and communications infrastructure, test and measurement systems, data acquisition, network acceleration, and embedded control with substantial parallel logic. The 256-I/O count is particularly useful when a design needs substantial board-level connectivity while retaining a single-programmable-device implementation rather than combining an FPGA with multiple support devices.
Board planning should prioritize the AMD UltraScale package pinout files, power-decoupling strategy, thermal management, and high-speed layout rules. A 676-FCBGA device normally requires multilayer PCB construction, controlled escape routing, and careful treatment of supply and ground planes. Use the package pinout files and the AMD device documentation when assigning balls, planning power rails, and validating every board-level connection.
This product summary combines the exact catalog attributes for the XCKU5P-1FFVA676E with application guidance, package considerations, and clearly defined alternatives. It is intended to accelerate component identification and initial design planning while directing final electrical, thermal, timing, and compliance decisions to the current AMD documentation.
ドロップイン代替品: XCKU5P-1FFVA676E — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: XCKU5P-1FFVA676E （同一形状・フットプリント） — 相違点: Device Type, Package Type.
XCKU5P-1FFVB676E
✅ ドロップイン価格はお問い合わせください
データシートを見る →XCKU5P-2FFVA676E
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XCKU5P-2FFVB676E
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XCKU5P-1FFVA676I
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XCKU5P-2FFVA676I
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XCKU5P-1FFVA676E 最大定格＆電気的特性
| Device Type | Kintex UltraScale+ FPGA |
| Number of I/O | 256 |
| Logic Cell Count | 41,984,000 |
| Logic Register Count | 474,600 |
| パッケージ | 676-FCBGA |
| Package Type | Fine-pitch ceramic ball grid array |
| Pin or Ball Count | 676 balls |
| Programmable Logic Type | FPGA |
| FPGA Family | Kintex UltraScale+ |
| Manufacturer | AMD |
| 実装タイプ | Surface mount |
| Speed Grade | -1 |
| Ordering Code | FFVA676E |
| RoHS ステータス | unknown |
| REACH Status | unknown |
| AEC-Q100 Qualification | unknown |
XCKU5P-1FFVA676E fine-pitch ceramic ball grid array ピン配置ガイド
XCKU5P-1FFVA676E (fine-pitch ceramic ball grid array パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: XCKU5P-1FFVA676E.
詳細は データシート をご参照ください。
主な用途
XCKU5P-1FFVA676E の用途: 6 件s: Industrial Imaging and Machine Vision, Radar and Communications Signal Processing, High-Speed Data Acquisition, Network Packet Processing, Test and Measurement Instrumentation, Aerospace and Defense Processing.
Industrial Imaging and Machine Vision
The XCKU5P-1FFVA676E fits industrial imaging systems that combine parallel pixel processing, feature extraction, image buffering, and machine-control logic. Its 41,984,000 catalog logic cells and 474,600 logic registers provide substantial capacity for concurrent processing pipelines, while 256 I/O support camera interfaces, line-scan sensors, converters, memory, and digital control signals. A designer can partition the fabric between acquisition timing, filtering, feature detection, and downstream control instead of relying on multiple processors. The 676-FCBGA package also offers a high pin count for complex multi-camera or high-resolution systems. Final selection should confirm converter interface rates, external-memory interfaces, clocking requirements, and the operating-temperature grade against the camera and factory-environment specifications.
おすすめ
Radar and Communications Signal Processing
The XCKU5P-1FFVA676E is suitable for radar, communications, and high-throughput signal-processing designs requiring parallel datapaths and extensive external connectivity. The large catalog logic count supports parallel filtering, correlation, modulation, spectrum processing, and control functions, while 256 I/O can connect converters, network processors, clocks, memories, and synchronization signals. The device allows latency-sensitive functions to remain in programmable hardware rather than relying entirely on host software. For deployed communications equipment, the implementation should use AMD UltraScale clocking, transceiver, and package guidance where applicable. Exact conversion bandwidth, internal-memory performance, transceiver configuration, and timing margins depend on the selected architecture and must be verified with the current AMD device documentation.
おすすめ
High-Speed Data Acquisition
The XCKU5P-1FFVA676E can serve as the central device in a multi-channel data-acquisition platform because its 256 I/O provide substantial parallel connectivity to ADCs, DACs, sensors, and test equipment. The 41,984,000 catalog logic cells allow simultaneous channel conditioning, calibration, filtering, timestamp handling, and data packing within one programmable architecture. A parallel FPGA implementation can reduce host-processor load and provide deterministic timing for synchronization and trigger distribution. The design should account for input capacitance, trace length matching, clock jitter, and power sequencing around the large FCBGA device. Acquisition bandwidth is not determined by the catalog I/O count alone, so signal integrity and the selected high-speed interface capabilities must be evaluated during schematic and layout development.
おすすめ
Network Packet Processing
The XCKU5P-1FFVA676E is appropriate for network appliances that require programmable packet inspection, buffering, protocol handling, and traffic shaping at line rates. Its large programmable-logic density allows multiple packet-processing stages to operate concurrently, and 256 I/O can support external network controllers, memory interfaces, status signals, and backplane links. The device is especially relevant when a fixed-function network processor cannot provide the required field programmability or custom telemetry. Power, performance, and thermal results depend on the chosen architecture, memory mapping, link width, and traffic mix, making post-route timing analysis essential. Designers should also review AMD's current transceiver and clocking guidance when the implementation uses high-speed serial links.
おすすめ
Test and Measurement Instrumentation
The XCKU5P-1FFVA676E is well suited to programmable test and measurement equipment requiring parallel stimulus generation, response capture, timing control, and real-time analysis. Its 256 I/O support instrument interfaces, trigger buses, converters, reference clocks, and communication channels, while the programmable fabric can implement deterministic control sequences and real-time measurement algorithms. A single-device implementation can reduce synchronization complexity by coordinating acquisition and analysis in parallel hardware. The board design must include careful clock distribution, analog-interface isolation, impedance control, and thermal planning around the 676-FCBGA package. Timing accuracy, supported I/O standards, and usable logic resources should be checked against the current AMD documentation and the instrument's calibration requirements.
おすすめ
Aerospace and Defense Processing
The XCKU5P-1FFVA676E can support advanced aerospace, defense, and space-processing workloads when its documented logic, I/O, environmental, and qualification characteristics meet the program requirements. The device offers 41,984,000 catalog logic cells, 474,600 logic registers, and 256 I/O for concurrent control, navigation, signal-processing, and communications functions. Its programmable architecture allows mission-specific logic to be updated without changing hardware, while the 676-FCBGA package supports dense board-level integration. Selection must not be based on family positioning alone: radiation effects, temperature range, reliability, screening, export controls, long-term supply, and configuration-management requirements require separate review. The current AMD radiation and product documentation should be consulted before using any XCKU5P ordering code in a flight or defense application.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XCKU5P-1FFVA676E — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XCKU5P-1FFVB676E | XCKU5P-2FFVA676E | XCKU5P-2FFVB676E | XCKU5P-1FFVA676I | XCKU5P-2FFVA676I |
|---|---|---|---|---|---|---|
| Package | 676-FCBGA | 676-FCBGA | 676-FCBGA | 676-FCBGA | 676-FCBGA | 676-FCBGA |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Device Family | Kintex UltraScale+ | Kintex UltraScale+ | Kintex UltraScale+ | Kintex UltraScale+ | Kintex UltraScale+ | Kintex UltraScale+ |
| Number of I/O | 256 | 280 | 256 | 280 | 256 | 256 |
| Logic Cell Count | 41,984,000 | 41,984,000 | 41,984,000 | 41,984,000 | 41,984,000 | 41,984,000 |
| Logic Register Count | 474,600 | 474,600 | 474,600 | 474,600 | 474,600 | 474,600 |
| Speed Grade | -1 | -1 | -2 | -2 | -1 | -2 |
| Temperature Suffix | E | E | E | E | I | I |
主な差別化要因
- Exact 256-I/O catalog configuration （vs XCKU5P-1FFVB676E)
- Lower speed-grade migration baseline （vs XCKU5P-2FFVA676E)
- Established package and architecture continuity （vs XCKU5P-2FFVA676I)
- High-density programmable architecture （vs XCKU5P-1FFVB676E)
設計ノート
Start the layout from the official AMD UltraScale package pinout files rather than transcribing balls from a distributor page. Confirm the exact XCKU5P device, speed grade, temperature suffix, power balls, and dedicated configuration pins before routing. A 676-FCBGA footprint normally requires multilayer PCB construction, laser or micro-via escape routing, and dedicated layers for power and ground distribution. Review the current package drawing for ball pitches, solder-mask design, component placement, and courtyard requirements before releasing the mechanical footprint.
Separate the FPGA's core and I/O supply planning into per-rail distribution, local decoupling, and sequencing blocks. Use the voltage and decoupling values specified by AMD for the exact device and speed grade, and account for the large transient current that can occur during configuration or logic activity. Estimate peak and average dissipation from the actual design utilization and I/O activity rather than a generic catalog value. Validate the complete power tree under worst-case state changes, startup, and shutdown conditions before prototype release.
Thermal analysis must include the PCB copper area available to the 676-FCBGA, internal layers, airflow, nearby components, and the highest expected switching activity. Use the manufacturer power-loss methodology with realistic logic utilization, clocking, transceiver activity, and I/O toggling; a nominal activity estimate can understate junction temperature. Maintain adequate thermal-via arrays and board-to-chassis heat paths, and verify the junction-temperature margin in the assembled enclosure. Any alternate ordering code must be reassessed for its distinct power and temperature characteristics.
Keep configuration, clock, and high-speed interface routing away from noisy switching regions, and follow the current AMD UltraScale layout guidance for each interface type. Use short return paths with continuous reference planes, control impedance according to the actual stack-up, and avoid stubs on high-speed nets. Pay particular attention to clock jitter, source-synchronous spacing, transceiver reference-clock routing, and simultaneous-switching-noise coupling into sensitive I/O. Post-route timing and signal-integrity checks are required for the final layer stack.
Do not assume that every XCKU5P ordering suffix is interchangeable. Speed grades affect timing margins, temperature suffixes affect environmental suitability, and package variants can change the available I/O count even when all candidates use a 676-FCBGA. The XCKU5P-1FFVB676E listing, for example, lists 280 I/O versus 256 I/O for the target. Before replacing the XCKU5P-1FFVA676E, compare the complete ball list, power plan, timing constraints, transceiver use, configuration method, and installed-tool support.
コンプライアンス情報
The technical attributes available for this device do not establish the requested compliance declarations. Confirm the exact ordering code, manufacturing status, and applicable declarations with AMD before release.