XCZU3EG-2SFVA625I - Zynq UltraScale+ MPSoC EG | AMD
部品番号: XCZU3EG-2SFVA625I ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $15.1 | $15.10 |
| 10 | $14.5 | $145.00 |
| 100 | $13.8 | $1,380.00 |
| 500 | $13 | $6,500.00 |
| 1,000 | $12.5 | $12,500.00 |
XCZU3EG-2SFVA625I 概要
A Zynq UltraScale+ MPSoC is a heterogeneous computing platform that combines multi-core ARM processing with FPGA fabric on a single die. This architecture enables designers to implement complex systems that require both high-level software control and hardware-accelerated data processing. The EG variant is optimized for embedded applications that need a balance of processing power, programmable logic capacity, and I/O flexibility, making it suitable for a wide range of industrial, aerospace, and defense applications.
Key features of the XCZU3EG-2SFVA625I include 154K+ logic cells, 360 DSP slices, and 7.6 Mb of block RAM, providing substantial programmable logic resources for custom hardware acceleration. The device supports a wide range of high-speed serial transceivers and general-purpose I/O, enabling flexible system integration. The processing system includes a memory management unit, cache coherency, and a rich set of peripherals, including USB 3.0, DisplayPort, SATA, and PCIe, which are essential for modern embedded systems.
The device is built on TSMC's 16nm FinFET process technology, which delivers high performance with low power consumption. The UltraScale+ architecture includes advanced clocking resources, high-bandwidth memory interfaces, and integrated blocks for PCIe and Ethernet, reducing the need for external components. The processing system and programmable logic are connected through a high-bandwidth AXI interconnect, enabling efficient data movement between software and hardware domains.
Typical applications for the XCZU3EG-2SFVA625I include software-defined radio, industrial motor control, machine vision, and aerospace avionics. The device's combination of real-time processing, application processing, and programmable logic makes it ideal for systems that require both deterministic control and complex signal processing. The device operates over a junction temperature range of -40°C to 100°C, making it suitable for harsh environments.
When designing with this device, careful attention must be paid to power supply sequencing and decoupling. The multiple power rails require a well-designed power distribution network to ensure reliable operation at high clock frequencies. The device also requires a configuration source, such as QSPI flash or SD card, to load the bitstream at power-up.
ドロップイン代替品: XCZU3EG-2SFVA625I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
XCZU3EG-L1SFVA625I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XCZU3EG-1SFVA625I
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XCZU2CG-1SFVA625I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XCZU3EG-2SFVA625I 最大定格＆電気的特性
| Processor Core | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight, ARM Mali-400 MP2 |
| Max Application Processor Frequency | 1.3 GHz |
| Max Real-Time Processor Frequency | 600 MHz |
| Max Programmable Logic Frequency | 533 MHz |
| Logic Cells | 154K+ |
| Block RAM | 7.6 Mb |
| DSP Slices | 360 |
| パッケージ | 625-FCBGA (21x21) |
| 動作温度範囲 | -40C to +100C (junction) |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
| Speed Grade | -2 |
| Family | Zynq UltraScale+ MPSoC EG |
| Process Technology | 16nm FinFET |
XCZU3EG-2SFVA625I ピン構成
| ピン A1 | VCCO_0 — I/O bank 0 supply voltage |
| ピン A2 | GND — Ground |
| ピン B1 | IO_L1P_T0_0 — User I/O bank 0 |
| ピン B2 | IO_L1N_T0_0 — User I/O bank 0 |
| ピン C1 | VCCINT — Internal core supply voltage |
| ピン C2 | GND — Ground |
| ピン D1 | IO_L2P_T0_0 — User I/O bank 0 |
| ピン D2 | IO_L2N_T0_0 — User I/O bank 0 |
| ピン E1 | VCCAUX — Auxiliary supply voltage |
| ピン E2 | GND — Ground |
| ピン F1 | IO_L3P_T0_0 — User I/O bank 0 |
| ピン F2 | IO_L3N_T0_0 — User I/O bank 0 |
主な用途
XCZU3EG-2SFVA625I の用途: 6 件s: Software-Defined Radio, Industrial Motor Control, Machine Vision, Aerospace Avionics, Automotive Driver Assistance, Data Center Acceleration.
Software-Defined Radio
The XCZU3EG-2SFVA625I is ideal for software-defined radio (SDR) systems due to its high-speed transceivers, 360 DSP slices, and 154K logic cells. The programmable logic can implement digital down/up conversion, filtering, and modulation/demodulation algorithms, while the ARM Cortex-A53 handles protocol stack and control. The Mali-400 GPU can accelerate waveform visualization. The device's high bandwidth AXI interconnect enables low-latency data transfer between the processing system and programmable logic, essential for real-time signal processing.
おすすめ
Industrial Motor Control
The XCZU3EG-2SFVA625I excels in industrial motor control applications by combining real-time processing from the dual-core Cortex-R5 with programmable logic for high-speed PWM generation and encoder interfaces. The 154K logic cells can implement multiple motor control loops, while the Cortex-A53 handles communication protocols like EtherCAT and PROFINET. The device's wide temperature range (-40C to 100C) ensures reliable operation in factory environments. The integrated PCIe and Ethernet interfaces simplify system integration with industrial networks.
おすすめ
Machine Vision
The XCZU3EG-2SFVA625I is well-suited for machine vision systems that require high-throughput image processing. The programmable logic can implement real-time image preprocessing, such as noise reduction and edge detection, while the ARM Cortex-A53 runs vision algorithms like object recognition. The Mali-400 GPU accelerates graphics processing for display output. The device's high-speed transceivers support camera interfaces like CoaXPress and GigE Vision. The 7.6 Mb block RAM provides on-chip buffering for image data, reducing external memory bandwidth requirements.
おすすめ
Aerospace Avionics
The XCZU3EG-2SFVA625I is widely used in aerospace avionics due to its high reliability, security features, and wide operating temperature range. The device supports secure boot and bitstream encryption, protecting critical flight software. The combination of ARM Cortex-A53 for mission management and Cortex-R5 for deterministic control makes it suitable for flight control systems. The programmable logic can implement custom interfaces for sensors and actuators. The device's 16nm FinFET process ensures low power consumption, critical for airborne systems with limited cooling.
おすすめ
Automotive Driver Assistance
The XCZU3EG-2SFVA625I is suitable for automotive driver assistance systems (ADAS) that require real-time sensor fusion and processing. The programmable logic can implement camera and LiDAR data preprocessing, while the ARM Cortex-A53 runs fusion algorithms. The dual-core Cortex-R5 provides deterministic control for safety-critical functions. The device's high-speed transceivers support automotive Ethernet and PCIe interfaces. The Mali-400 GPU can accelerate display rendering for driver information systems. The device operates over the automotive temperature range, ensuring reliable operation in vehicle environments.
おすすめ
Data Center Acceleration
The XCZU3EG-2SFVA625I can be used in data center applications for workload acceleration, such as network processing and storage controllers. The programmable logic can implement custom packet processing pipelines, while the ARM Cortex-A53 handles control plane functions. The integrated PCIe interface enables high-speed connection to host servers. The device's 154K logic cells and 360 DSP slices provide substantial compute resources for offloading tasks from the CPU. The low power consumption of the 16nm FinFET process makes it suitable for dense server deployments.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XCZU3EG-2SFVA625I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XCZU3EG-L1SFVA625I | XCZU3EG-1SFVA625I | XCZU2CG-1SFVA625I |
|---|---|---|---|---|
| Package | 625-FCBGA (21x21) | 625-FCBGA (21x21) - same | 625-FCBGA (21x21) - same | 625-FCBGA (21x21) - same |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 154K+ | 154K+ | 154K+ | 103K+ |
| Speed Grade | -2 | -L1 | -1 | -1 |
| Max Application Processor Frequency | 1.3 GHz | 1.2 GHz | 1.2 GHz | 1.2 GHz |
| Max Real-Time Processor Frequency | 600 MHz | 600 MHz | 600 MHz | 600 MHz |
| DSP Slices | 360 | 360 | 360 | 240 |
| Block RAM | 7.6 Mb | 7.6 Mb | 7.6 Mb | 5.1 Mb |
主な差別化要因
- Higher speed grade (-2) for maximum performance （vs XCZU3EG-L1SFVA625I)
- EG variant with more logic resources （vs XCZU2CG-1SFVA625I)
- Full-speed grade for timing closure （vs XCZU3EG-1SFVA625I)
設計ノート
The XCZU3EG-2SFVA625I requires multiple power rails including VCCINT, VCCAUX, and VCCO. Use a dedicated power management IC to sequence these rails correctly at power-up. Refer to the Zynq UltraScale+ power supply requirements in the datasheet for exact voltage and current specifications. Inadequate decoupling can cause intermittent failures at high clock frequencies.
The device operates up to 100C junction temperature. For high-performance applications, use a heatsink or active cooling to maintain junction temperature within limits. The 625-FCBGA package has a thermal resistance that requires careful PCB design with thermal vias and copper pours. Calculate power dissipation based on logic utilization and clock frequency to determine cooling requirements.
Route high-speed serial transceivers with controlled impedance and minimize trace length. Use ground planes under all high-speed signals to reduce EMI. Place decoupling capacitors close to the power pins. Follow AMD's PCB design guidelines in UG583 for optimal signal integrity and power integrity.
コンプライアンス情報
RoHS compliant per distributor listings. AEC-Q100 not applicable for FPGA/SoC devices.
