XCZU3EG-2SFVA625I - Zynq UltraScale+ MPSoC EG | AMD
MPN: XCZU3EG-2SFVA625I β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $15.1 | $15.10 |
| 10 | $14.5 | $145.00 |
| 100 | $13.8 | $1,380.00 |
| 500 | $13 | $6,500.00 |
| 1,000 | $12.5 | $12,500.00 |
Drop-in alternatives for XCZU3EG-2SFVA625I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XCZU3EG-L1SFVA625I
β Drop-Inπ Reference alternative (not in catalog)
XCZU3EG-1SFVA625I
β Drop-Inπ Reference alternative (not in catalog)
XCZU2CG-1SFVA625I
β Drop-Inπ Reference alternative (not in catalog)
XCZU3EG-2SFVA625I Maximum Ratings & Electrical Characteristics
| Processor Core | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight, ARM Mali-400 MP2 |
| Max Application Processor Frequency | 1.3 GHz |
| Max Real-Time Processor Frequency | 600 MHz |
| Max Programmable Logic Frequency | 533 MHz |
| Logic Cells | 154K+ |
| Block RAM | 7.6 Mb |
| DSP Slices | 360 |
| Package | 625-FCBGA (21x21) |
| Operating Temperature Range | -40C to +100C (junction) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Speed Grade | -2 |
| Family | Zynq UltraScale+ MPSoC EG |
| Process Technology | 16nm FinFET |
| I/O Count | [DATA_NEEDED: I/O count] |
XCZU3EG-2SFVA625I Pin Configuration
| Pin A1 | VCCO_0 β I/O bank 0 supply voltage |
| Pin A2 | GND β Ground |
| Pin B1 | IO_L1P_T0_0 β User I/O bank 0 |
| Pin B2 | IO_L1N_T0_0 β User I/O bank 0 |
| Pin C1 | VCCINT β Internal core supply voltage |
| Pin C2 | GND β Ground |
| Pin D1 | IO_L2P_T0_0 β User I/O bank 0 |
| Pin D2 | IO_L2N_T0_0 β User I/O bank 0 |
| Pin E1 | VCCAUX β Auxiliary supply voltage |
| Pin E2 | GND β Ground |
| Pin F1 | IO_L3P_T0_0 β User I/O bank 0 |
| Pin F2 | IO_L3N_T0_0 β User I/O bank 0 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XCZU3EG-2SFVA625I is suitable for 6 applications: Software-Defined Radio, Industrial Motor Control, Machine Vision, Aerospace Avionics, Automotive Driver Assistance, Data Center Acceleration.
Software-Defined Radio
The XCZU3EG-2SFVA625I is ideal for software-defined radio (SDR) systems due to its high-speed transceivers, 360 DSP slices, and 154K logic cells. The programmable logic can implement digital down/up conversion, filtering, and modulation/demodulation algorithms, while the ARM Cortex-A53 handles protocol stack and control. The Mali-400 GPU can accelerate waveform visualization. The device's high bandwidth AXI interconnect enables low-latency data transfer between the processing system and programmable logic, essential for real-time signal processing.
Recommended
Industrial Motor Control
The XCZU3EG-2SFVA625I excels in industrial motor control applications by combining real-time processing from the dual-core Cortex-R5 with programmable logic for high-speed PWM generation and encoder interfaces. The 154K logic cells can implement multiple motor control loops, while the Cortex-A53 handles communication protocols like EtherCAT and PROFINET. The device's wide temperature range (-40C to 100C) ensures reliable operation in factory environments. The integrated PCIe and Ethernet interfaces simplify system integration with industrial networks.
Recommended
Machine Vision
The XCZU3EG-2SFVA625I is well-suited for machine vision systems that require high-throughput image processing. The programmable logic can implement real-time image preprocessing, such as noise reduction and edge detection, while the ARM Cortex-A53 runs vision algorithms like object recognition. The Mali-400 GPU accelerates graphics processing for display output. The device's high-speed transceivers support camera interfaces like CoaXPress and GigE Vision. The 7.6 Mb block RAM provides on-chip buffering for image data, reducing external memory bandwidth requirements.
Recommended
Aerospace Avionics
The XCZU3EG-2SFVA625I is widely used in aerospace avionics due to its high reliability, security features, and wide operating temperature range. The device supports secure boot and bitstream encryption, protecting critical flight software. The combination of ARM Cortex-A53 for mission management and Cortex-R5 for deterministic control makes it suitable for flight control systems. The programmable logic can implement custom interfaces for sensors and actuators. The device's 16nm FinFET process ensures low power consumption, critical for airborne systems with limited cooling.
Recommended
Automotive Driver Assistance
The XCZU3EG-2SFVA625I is suitable for automotive driver assistance systems (ADAS) that require real-time sensor fusion and processing. The programmable logic can implement camera and LiDAR data preprocessing, while the ARM Cortex-A53 runs fusion algorithms. The dual-core Cortex-R5 provides deterministic control for safety-critical functions. The device's high-speed transceivers support automotive Ethernet and PCIe interfaces. The Mali-400 GPU can accelerate display rendering for driver information systems. The device operates over the automotive temperature range, ensuring reliable operation in vehicle environments.
Recommended
Data Center Acceleration
The XCZU3EG-2SFVA625I can be used in data center applications for workload acceleration, such as network processing and storage controllers. The programmable logic can implement custom packet processing pipelines, while the ARM Cortex-A53 handles control plane functions. The integrated PCIe interface enables high-speed connection to host servers. The device's 154K logic cells and 360 DSP slices provide substantial compute resources for offloading tasks from the CPU. The low power consumption of the 16nm FinFET process makes it suitable for dense server deployments.
Recommended
Recommended Products Summary
Engineering reference data for XCZU3EG-2SFVA625I β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XCZU3EG-L1SFVA625I | XCZU3EG-1SFVA625I | XCZU2CG-1SFVA625I |
|---|---|---|---|---|
| Package | 625-FCBGA (21x21) | 625-FCBGA (21x21) - same | 625-FCBGA (21x21) - same | 625-FCBGA (21x21) - same |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 154K+ | 154K+ | 154K+ | 103K+ |
| Speed Grade | -2 | -L1 | -1 | -1 |
| Max Application Processor Frequency | 1.3 GHz | 1.2 GHz | 1.2 GHz | 1.2 GHz |
| Max Real-Time Processor Frequency | 600 MHz | 600 MHz | 600 MHz | 600 MHz |
| DSP Slices | 360 | 360 | 360 | 240 |
| Block RAM | 7.6 Mb | 7.6 Mb | 7.6 Mb | 5.1 Mb |
Key Differentiators
- Higher speed grade (-2) for maximum performance (vs XCZU3EG-L1SFVA625I)
- EG variant with more logic resources (vs XCZU2CG-1SFVA625I)
- Full-speed grade for timing closure (vs XCZU3EG-1SFVA625I)
Design Notes
The XCZU3EG-2SFVA625I requires multiple power rails including VCCINT, VCCAUX, and VCCO. Use a dedicated power management IC to sequence these rails correctly at power-up. Refer to the Zynq UltraScale+ power supply requirements in the datasheet for exact voltage and current specifications. Inadequate decoupling can cause intermittent failures at high clock frequencies.
The device operates up to 100C junction temperature. For high-performance applications, use a heatsink or active cooling to maintain junction temperature within limits. The 625-FCBGA package has a thermal resistance that requires careful PCB design with thermal vias and copper pours. Calculate power dissipation based on logic utilization and clock frequency to determine cooling requirements.
Route high-speed serial transceivers with controlled impedance and minimize trace length. Use ground planes under all high-speed signals to reduce EMI. Place decoupling capacitors close to the power pins. Follow AMD's PCB design guidelines in UG583 for optimal signal integrity and power integrity.
Compliance Information
RoHS compliant per distributor listings. AEC-Q100 not applicable for FPGA/SoC devices.
