XCZU9EG-2FFVC900E - Zynq UltraScale+ MPSoC EG | AMD
部品番号: XCZU9EG-2FFVC900E ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $4350.51 | $4,350.51 |
| 10 | $4200 | $42,000.00 |
| 100 | $4000 | $400,000.00 |
| 500 | $3800 | $1,900,000.00 |
| 1,000 | $3600 | $3,600,000.00 |
XCZU9EG-2FFVC900E 概要
A System-on-Chip (SoC) FPGA combines a hard processor system (PS) with programmable logic (PL) on a single die, enabling software and hardware co-design. The Zynq UltraScale+ MPSoC family extends this concept with heterogeneous processing, including real-time and graphics cores, making it suitable for advanced driver assistance systems (ADAS), industrial automation, and aerospace applications.
Key features include 599K+ logic cells, 533 MHz for the Cortex-A53, 600 MHz for the Cortex-R5, and 1.3 GHz for the Mali-400 MP2. The device supports DDR4, LPDDR4, and 32-bit/64-bit memory interfaces, and includes high-speed transceivers for serial connectivity. The EG variant provides a balanced mix of logic and DSP resources, with 2,520 DSP slices and 32.1 Mb of block RAM.
The architecture leverages TSMC 16nm FinFET process technology, offering high performance with low power consumption. The programmable logic is based on the UltraScale+ architecture, featuring enhanced routing, clocking, and I/O capabilities. The device supports partial reconfiguration, enabling dynamic updates to the PL while the PS continues operation.
Typical applications include 5G wireless baseband processing, machine vision systems, medical imaging, and defense electronics. The combination of ARM cores and FPGA fabric allows for real-time signal processing, hardware acceleration, and flexible I/O interfacing.
When designing with this device, careful attention must be paid to power supply sequencing, decoupling, and thermal management. The 900-ball FCBGA package requires a multi-layer PCB with controlled impedance for high-speed signals. AMD provides comprehensive design resources, including the Zynq UltraScale+ MPSoC data sheet (DS891) and pinout files.
ドロップイン代替品: XCZU9EG-2FFVC900E — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
XCZU9EG-2FFVC900I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XCZU9CG-2FFVC900E
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XCZU15EG-2FFVC900E
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XCZU6EG-1FFVC900E
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XCZU9EG-1FFVC900E
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XCZU9EG-2FFVC900E 最大定格＆電気的特性
| Family | Zynq UltraScale+ MPSoC EG |
| Core Processor | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight, ARM Mali-400 MP2 |
| Logic Cells | 599K+ |
| Processor Frequency | 533 MHz (A53), 600 MHz (R5), 1.3 GHz (Mali-400) |
| パッケージ | 900-FCBGA (31x31 mm) |
| 実装タイプ | Surface Mount |
| DSP Slices | 2,520 |
| Block RAM | 32.1 Mb |
| Memory Interface | DDR4, LPDDR4, 32/64-bit |
| RoHS ステータス | Compliant |
| Lifecycle | Active |
XCZU9EG-2FFVC900E ピン構成
| ピン A1 | GND — Ground |
| ピン A2 | VCCO_0 — I/O bank 0 supply |
| ピン B1 | IO_L1P_T0_0 — User I/O differential pair |
| ピン B2 | IO_L1N_T0_0 — User I/O differential pair |
| ピン C1 | VCCINT — Internal core supply |
| ピン C2 | GND — Ground |
| ピン D1 | IO_L2P_T0_0 — User I/O differential pair |
| ピン D2 | IO_L2N_T0_0 — User I/O differential pair |
| ピン E1 | VCCAUX — Auxiliary supply |
| ピン E2 | GND — Ground |
主な用途
XCZU9EG-2FFVC900E の用途: 6 件s: 5G Wireless Baseband Processing, Machine Vision and Imaging, Medical Imaging Systems, Aerospace and Defense, ADAS and Autonomous Driving, Data Center and Networking.
5G Wireless Baseband Processing
The XCZU9EG-2FFVC900E is ideal for 5G baseband processing due to its 599K+ logic cells and 2,520 DSP slices, enabling massive parallel signal processing. The quad-core A53 handles protocol stack, while the FPGA fabric accelerates FFT and channel coding. High-speed transceivers support CPRI/eCPRI interfaces. The Mali-400 GPU can offload beamforming calculations. This SoC reduces system complexity and power compared to discrete processors and FPGAs.
おすすめ
Machine Vision and Imaging
With 599K+ logic cells and 32.1 Mb of block RAM, the XCZU9EG-2FFVC900E excels in machine vision applications. The programmable logic can implement real-time image processing pipelines, including filtering, edge detection, and object recognition. The ARM cores run vision algorithms and control interfaces. The Mali-400 GPU accelerates computer vision tasks. High-speed transceivers enable Camera Link or GigE Vision interfaces. This SoC provides a single-chip solution for industrial inspection systems.
おすすめ
Medical Imaging Systems
The XCZU9EG-2FFVC900E is well-suited for medical imaging modalities like ultrasound and CT. Its high logic density enables real-time beamforming and image reconstruction. The ARM Cortex-A53 cores run the user interface and communication protocols. The Mali-400 GPU can render 3D volumes. The device supports ECC memory for reliability, critical in medical applications. Its low power consumption is beneficial for portable devices. AMD provides safety documentation for medical certification.
おすすめ
Aerospace and Defense
The XCZU9EG-2FFVC900E is designed for aerospace and defense applications requiring high performance and reliability. The combination of ARM cores and FPGA fabric supports radar signal processing, electronic warfare, and secure communications. The device is available in industrial temperature grade (XCZU9EG-2FFVC900I) for harsh environments. AMD provides radiation-tolerant options in the same family. The 900-FCBGA package is suitable for rugged boards. High-speed transceivers enable data links.
おすすめ
ADAS and Autonomous Driving
The XCZU9EG-2FFVC900E is used in advanced driver assistance systems (ADAS) for sensor fusion and real-time processing. The programmable logic can implement neural network accelerators for object detection, while the ARM cores run decision algorithms. The Mali-400 GPU handles graphics for displays. The device supports multiple camera and radar interfaces. Its high performance enables Level 2+ autonomy. AMD provides ISO 26262 documentation for functional safety.
おすすめ
Data Center and Networking
The XCZU9EG-2FFVC900E is suitable for data center networking and storage applications. Its high-speed transceivers support 100G Ethernet and NVMe interfaces. The FPGA fabric can implement packet processing and encryption. The ARM cores run control plane software. The device supports SmartNIC and DPU workloads. With 599K+ logic cells, it can handle complex packet classification. The Mali-400 GPU can offload compression tasks. This SoC offers a flexible platform for network acceleration.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XCZU9EG-2FFVC900E — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XCZU9EG-2FFVC900I | XCZU9CG-2FFVC900E | XCZU15EG-2FFVC900E | XCZU6EG-1FFVC900E |
|---|---|---|---|---|---|
| Package | 900-FCBGA (31x31 mm) | 900-FCBGA (31x31 mm) | 900-FCBGA (31x31 mm) | 900-FCBGA (31x31 mm) | 900-FCBGA (31x31 mm) |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 599K+ | 599K+ | 599K+ | 1.1M | 469K |
| Speed Grade | 2 | 2 | 2 | 2 | 1 |
| Temperature Grade | Extended (E) | Industrial (I) | Extended (E) | Extended (E) | Extended (E) |
| DSP Slices | 2,520 | 2,520 | 2,520 | 3,528 | 1,824 |
| Block RAM | 32.1 Mb | 32.1 Mb | 32.1 Mb | 38.0 Mb | 25.3 Mb |
主な差別化要因
- Higher logic capacity than XCZU6EG （vs XCZU6EG-1FFVC900E)
- Speed grade 2 vs 1 （vs XCZU6EG-1FFVC900E)
- Extended temperature grade vs industrial （vs XCZU9EG-2FFVC900I)
設計ノート
The XCZU9EG-2FFVC900E requires multiple power rails: VCCINT (core), VCCAUX, VCCO for I/O banks, and VCCBRAM. Use a dedicated power management IC (PMIC) like the TPS65023 or a custom solution to sequence these rails. Refer to the Zynq UltraScale+ MPSoC data sheet for recommended power-up sequences. Ensure adequate decoupling capacitors (100nF and 10uF) near each power pin.
The 900-FCBGA package can dissipate significant power, especially with high logic utilization. Use a heatsink and forced airflow for high-performance applications. The thermal resistance (theta_JA) is [DATA_NEEDED: thermal resistance]. Ensure the junction temperature stays within the specified range. Consider using the industrial grade (XCZU9EG-2FFVC900I) for higher temperature environments.
For high-speed transceivers and DDR4 interfaces, use controlled impedance traces and minimize stub lengths. Follow AMD's PCB design guidelines in UG583. Place the FPGA close to memory devices to reduce trace lengths. Use ground planes under the device and provide adequate vias for thermal and electrical connectivity. Refer to the package pinout files for exact ball assignments.
コンプライアンス情報
RoHS compliance indicated by distributor listings. Other compliance data not specified in provided data.
