XCZU9EG-2FFVC900E - Zynq UltraScale+ MPSoC EG | AMD
MPN: XCZU9EG-2FFVC900E β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4350.51 | $4,350.51 |
| 10 | $4200 | $42,000.00 |
| 100 | $4000 | $400,000.00 |
| 500 | $3800 | $1,900,000.00 |
| 1,000 | $3600 | $3,600,000.00 |
Drop-in alternatives for XCZU9EG-2FFVC900E β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XCZU9EG-2FFVC900I
β Drop-Inπ Reference alternative (not in catalog)
XCZU9CG-2FFVC900E
β Drop-Inπ Reference alternative (not in catalog)
XCZU15EG-2FFVC900E
β Drop-Inπ Reference alternative (not in catalog)
XCZU6EG-1FFVC900E
β Drop-Inπ Reference alternative (not in catalog)
XCZU9EG-1FFVC900E
β Drop-Inπ Reference alternative (not in catalog)
XCZU9EG-2FFVC900E Maximum Ratings & Electrical Characteristics
| Family | Zynq UltraScale+ MPSoC EG |
| Core Processor | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight, ARM Mali-400 MP2 |
| Logic Cells | 599K+ |
| Processor Frequency | 533 MHz (A53), 600 MHz (R5), 1.3 GHz (Mali-400) |
| Package | 900-FCBGA (31x31 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | [DATA_NEEDED: operating temperature range] |
| Supply Voltage | [DATA_NEEDED: supply voltage range] |
| Number of I/O | [DATA_NEEDED: number of user I/O] |
| DSP Slices | 2,520 |
| Block RAM | 32.1 Mb |
| Transceivers | [DATA_NEEDED: transceiver count and speed] |
| Memory Interface | DDR4, LPDDR4, 32/64-bit |
| RoHS Status | Compliant |
| Lifecycle | Active |
XCZU9EG-2FFVC900E Pin Configuration
| Pin A1 | GND β Ground |
| Pin A2 | VCCO_0 β I/O bank 0 supply |
| Pin B1 | IO_L1P_T0_0 β User I/O differential pair |
| Pin B2 | IO_L1N_T0_0 β User I/O differential pair |
| Pin C1 | VCCINT β Internal core supply |
| Pin C2 | GND β Ground |
| Pin D1 | IO_L2P_T0_0 β User I/O differential pair |
| Pin D2 | IO_L2N_T0_0 β User I/O differential pair |
| Pin E1 | VCCAUX β Auxiliary supply |
| Pin E2 | GND β Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XCZU9EG-2FFVC900E is suitable for 6 applications: 5G Wireless Baseband Processing, Machine Vision and Imaging, Medical Imaging Systems, Aerospace and Defense, ADAS and Autonomous Driving, Data Center and Networking.
5G Wireless Baseband Processing
The XCZU9EG-2FFVC900E is ideal for 5G baseband processing due to its 599K+ logic cells and 2,520 DSP slices, enabling massive parallel signal processing. The quad-core A53 handles protocol stack, while the FPGA fabric accelerates FFT and channel coding. High-speed transceivers support CPRI/eCPRI interfaces. The Mali-400 GPU can offload beamforming calculations. This SoC reduces system complexity and power compared to discrete processors and FPGAs.
Recommended
Machine Vision and Imaging
With 599K+ logic cells and 32.1 Mb of block RAM, the XCZU9EG-2FFVC900E excels in machine vision applications. The programmable logic can implement real-time image processing pipelines, including filtering, edge detection, and object recognition. The ARM cores run vision algorithms and control interfaces. The Mali-400 GPU accelerates computer vision tasks. High-speed transceivers enable Camera Link or GigE Vision interfaces. This SoC provides a single-chip solution for industrial inspection systems.
Recommended
Medical Imaging Systems
The XCZU9EG-2FFVC900E is well-suited for medical imaging modalities like ultrasound and CT. Its high logic density enables real-time beamforming and image reconstruction. The ARM Cortex-A53 cores run the user interface and communication protocols. The Mali-400 GPU can render 3D volumes. The device supports ECC memory for reliability, critical in medical applications. Its low power consumption is beneficial for portable devices. AMD provides safety documentation for medical certification.
Recommended
Aerospace and Defense
The XCZU9EG-2FFVC900E is designed for aerospace and defense applications requiring high performance and reliability. The combination of ARM cores and FPGA fabric supports radar signal processing, electronic warfare, and secure communications. The device is available in industrial temperature grade (XCZU9EG-2FFVC900I) for harsh environments. AMD provides radiation-tolerant options in the same family. The 900-FCBGA package is suitable for rugged boards. High-speed transceivers enable data links.
Recommended
ADAS and Autonomous Driving
The XCZU9EG-2FFVC900E is used in advanced driver assistance systems (ADAS) for sensor fusion and real-time processing. The programmable logic can implement neural network accelerators for object detection, while the ARM cores run decision algorithms. The Mali-400 GPU handles graphics for displays. The device supports multiple camera and radar interfaces. Its high performance enables Level 2+ autonomy. AMD provides ISO 26262 documentation for functional safety.
Recommended
Data Center and Networking
The XCZU9EG-2FFVC900E is suitable for data center networking and storage applications. Its high-speed transceivers support 100G Ethernet and NVMe interfaces. The FPGA fabric can implement packet processing and encryption. The ARM cores run control plane software. The device supports SmartNIC and DPU workloads. With 599K+ logic cells, it can handle complex packet classification. The Mali-400 GPU can offload compression tasks. This SoC offers a flexible platform for network acceleration.
Recommended
Recommended Products Summary
Engineering reference data for XCZU9EG-2FFVC900E β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XCZU9EG-2FFVC900I | XCZU9CG-2FFVC900E | XCZU15EG-2FFVC900E | XCZU6EG-1FFVC900E |
|---|---|---|---|---|---|
| Package | 900-FCBGA (31x31 mm) | 900-FCBGA (31x31 mm) | 900-FCBGA (31x31 mm) | 900-FCBGA (31x31 mm) | 900-FCBGA (31x31 mm) |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 599K+ | 599K+ | 599K+ | 1.1M | 469K |
| Speed Grade | 2 | 2 | 2 | 2 | 1 |
| Temperature Grade | Extended (E) | Industrial (I) | Extended (E) | Extended (E) | Extended (E) |
| DSP Slices | 2,520 | 2,520 | 2,520 | 3,528 | 1,824 |
| Block RAM | 32.1 Mb | 32.1 Mb | 32.1 Mb | 38.0 Mb | 25.3 Mb |
| Price (qty 1) | $4,350.51 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Higher logic capacity than XCZU6EG (vs XCZU6EG-1FFVC900E)
- Speed grade 2 vs 1 (vs XCZU6EG-1FFVC900E)
- Extended temperature grade vs industrial (vs XCZU9EG-2FFVC900I)
Design Notes
The XCZU9EG-2FFVC900E requires multiple power rails: VCCINT (core), VCCAUX, VCCO for I/O banks, and VCCBRAM. Use a dedicated power management IC (PMIC) like the TPS65023 or a custom solution to sequence these rails. Refer to the Zynq UltraScale+ MPSoC data sheet for recommended power-up sequences. Ensure adequate decoupling capacitors (100nF and 10uF) near each power pin.
The 900-FCBGA package can dissipate significant power, especially with high logic utilization. Use a heatsink and forced airflow for high-performance applications. The thermal resistance (theta_JA) is [DATA_NEEDED: thermal resistance]. Ensure the junction temperature stays within the specified range. Consider using the industrial grade (XCZU9EG-2FFVC900I) for higher temperature environments.
For high-speed transceivers and DDR4 interfaces, use controlled impedance traces and minimize stub lengths. Follow AMD's PCB design guidelines in UG583. Place the FPGA close to memory devices to reduce trace lengths. Use ground planes under the device and provide adequate vias for thermal and electrical connectivity. Refer to the package pinout files for exact ball assignments.
Compliance Information
RoHS compliance indicated by distributor listings. Other compliance data not specified in provided data.
