PIC16LF15356T-E/MVVAO
PIC16LF15356T-E/MVVAO - 8-bit MCU, 28KB Flash, 28-UQFN | Microchip
The Microchip Technology PIC16LF15356T-E/MVVAO is an 8-bit RISC microcontroller from the PIC16(L)F153xx family with 28KB Flash program memory, 2KB SRAM, 26 I/O pins, and four 10-bit PWMs, supplied in a 28-pin UQFN (4x4 mm) exposed-pad package rated for the automotive -40C to +125C extended temperature grade. It integrates a 32 MHz internal oscillator, intelligent analog peripherals including a 10-bit ADC with computation, a 5-/8-bit DAC, comparators, and a Complementary Waveform Generator (CWG), alongside communication peripherals such as two EUSART, two SPI, and two I2C modules. The LF prefix denotes the eXtreme Low-Power (XLP) variant optimized for battery-backed and energy-harvesting applications, featuring low sleep currents typical of the PIC16F153xx family.
An 8-bit microcontroller (MCU) is a single-chip computer built around an 8-bit data path CPU, on-chip non-volatile program memory (Flash), volatile data memory (SRAM), and a fixed set of integrated peripherals such as timers, ADCs, and communication interfaces. Within the broader semiconductor taxonomy, an MCU sits under microcontroller -> embedded processor -> semiconductor device, and the PIC16LF153xx family specifically belongs to Microchip's mid-range PIC16 enhanced core line (PIC16 -> 8-bit PIC -> Microchip PIC architecture). The 8-bit architecture trades raw computation throughput for deterministic interrupt response, low power, and code density, which is why PIC MCUs remain prevalent in cost- and power-sensitive embedded designs.
Key differentiating features include the Core Independent Peripherals (CIPs) such as the CWG, the Angular Timer, and the Numerically Controlled Oscillator (NCO), which let the device execute signal-generation, sensor-interfacing, and communication tasks in hardware without CPU intervention. The 10-bit ADC with Computation (ADC2) integrates averaging, threshold comparison, and burst-averaging modes, offloading common signal-conditioning work from the core. Two EUSART blocks support LIN master/slave, RS-485, and IrDA, while two SPI and two I2C peripherals enable simultaneous multi-bus sensor or display interfacing.
The 28-UQFN (4x4 mm) HVQCCN exposed-pad package is the smallest footprint option in this family and requires careful PCB thermal layout because most heat is dissipated through the EP. Tape-and-reel packaging (-T suffix) supports high-volume SMT assembly, while the /MVVAO suffix indicates the UQFN package, automotive grade, and tape-and-reel orientation. The /MVVAO part is qualified per Microchip's automotive flow and AEC-Q100, distinguishing it from commercial-temperature variants such as /ML or /SO in the same PIC16LF15356 silicon family.
Typical applications include automotive body and HVAC control modules, LIN sensor nodes, IoT sensor hubs, low-power wireless sensor interface controllers, and small industrial HMI or LED-driving subsystems. Design considerations should focus on the exposed-pad PCB land pattern for proper thermal dissipation, selection of the LF variant (versus the non-LF PIC16F15356) when sleep current matters, and verification of the automotive temperature grade against the deployment environment. This page synthesizes distributor inventory, same-package drop-in alternatives, and practical design guidance not consolidated in the standalone datasheet.
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