PIC16LF15356T-E/MVVAO - 8-bit MCU, 28KB Flash, 28-UQFN | Microchip
부품 번호: PIC16LF15356T-E/MVVAO ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2.85 | $2.85 |
| 10 | $2.56 | $25.60 |
| 100 | $2.28 | $228.00 |
| 500 | $2.04 | $1,020.00 |
| 1,000 | $1.81 | $1,810.00 |
PIC16LF15356T-E/MVVAO 개요
An 8-bit microcontroller (MCU) is a single-chip computer built around an 8-bit data path CPU, on-chip non-volatile program memory (Flash), volatile data memory (SRAM), and a fixed set of integrated peripherals such as timers, ADCs, and communication interfaces. Within the broader semiconductor taxonomy, an MCU sits under microcontroller -> embedded processor -> semiconductor device, and the PIC16LF153xx family specifically belongs to Microchip's mid-range PIC16 enhanced core line (PIC16 -> 8-bit PIC -> Microchip PIC architecture). The 8-bit architecture trades raw computation throughput for deterministic interrupt response, low power, and code density, which is why PIC MCUs remain prevalent in cost- and power-sensitive embedded designs.
Key differentiating features include the Core Independent Peripherals (CIPs) such as the CWG, the Angular Timer, and the Numerically Controlled Oscillator (NCO), which let the device execute signal-generation, sensor-interfacing, and communication tasks in hardware without CPU intervention. The 10-bit ADC with Computation (ADC2) integrates averaging, threshold comparison, and burst-averaging modes, offloading common signal-conditioning work from the core. Two EUSART blocks support LIN master/slave, RS-485, and IrDA, while two SPI and two I2C peripherals enable simultaneous multi-bus sensor or display interfacing.
The 28-UQFN (4x4 mm) HVQCCN exposed-pad package is the smallest footprint option in this family and requires careful PCB thermal layout because most heat is dissipated through the EP. Tape-and-reel packaging (-T suffix) supports high-volume SMT assembly, while the /MVVAO suffix indicates the UQFN package, automotive grade, and tape-and-reel orientation. The /MVVAO part is qualified per Microchip's automotive flow and AEC-Q100, distinguishing it from commercial-temperature variants such as /ML or /SO in the same PIC16LF15356 silicon family.
Typical applications include automotive body and HVAC control modules, LIN sensor nodes, IoT sensor hubs, low-power wireless sensor interface controllers, and small industrial HMI or LED-driving subsystems. Design considerations should focus on the exposed-pad PCB land pattern for proper thermal dissipation, selection of the LF variant (versus the non-LF PIC16F15356) when sleep current matters, and verification of the automotive temperature grade against the deployment environment. This page synthesizes distributor inventory, same-package drop-in alternatives, and practical design guidance not consolidated in the standalone datasheet.
드롭인 대체품: PIC16LF15356T-E/MVVAO — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC16LF15356T-E/MVVAO (동일 폼 팩터 및 풋프린트) — 차이점: Comparators, Operating Temperature, Package, ADC, DAC.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC16LF15356-I/ML
✅ 드롭인✓ 재고 있음
$0.96 / 개
데이터시트 보기 →PIC16LF15355-I/MV
✅ 드롭인✓ 재고 있음
$1.05 / 개
데이터시트 보기 →PIC16LF15356-E/MVVAO
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC16F15356T-E/MVVAO
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC16LF15354-I/MV
✅ 드롭인✓ 재고 있음
$0.89 / 개
데이터시트 보기 →PIC16LF15356T-E/MVVAO 최대 정격 & 전기적 특성
| Product Family | PIC16(L)F153xx 8-bit Microcontrollers |
| Core Architecture | PIC16 Enhanced 8-bit RISC |
| Program Memory (Flash) | 28 KB (16K x 14 words) |
| Data Memory (SRAM) | 2 KB |
| Data EEPROM | 256 bytes (per family datasheet) |
| Maximum CPU Speed | 32 MHz |
| Operating Voltage Range | 1.8 V to 3.6 V (LF variant) |
| Number of I/O Pins | 26 |
| ADC | 10-bit ADC with Computation (ADC2) |
| DAC | 5-bit and 8-bit DAC |
| Comparators | Yes (per family datasheet) |
| PWM Modules | 4 x 10-bit PWM |
| Communication Peripherals | 2x EUSART (LIN/RS-485/IrDA), 2x SPI, 2x I2C |
| 패키지 | 28-pin UQFN (4x4 mm) with Exposed Pad (HVQCCN) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +125C (Automotive / E grade) |
| Temperature Grade | Automotive (AEC-Q100) |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
PIC16LF15356T-E/MVVAO 핀 구성
| 핀 1 | RA0 — Bidirectional I/O / analog input |
| 핀 2 | RA1 — Bidirectional I/O / analog input |
| 핀 3 | RA2 — Bidirectional I/O / analog input |
| 핀 4 | RA3 — Bidirectional I/O / analog input |
| 핀 5 | RA4 — Bidirectional I/O / analog input |
| 핀 6 | RA5 — Bidirectional I/O / analog input |
| 핀 7 | RA6 — Bidirectional I/O / analog input |
| 핀 8 | RA7 — Bidirectional I/O / analog input |
| 핀 9 | VSS — Ground reference |
| 핀 10 | VDD — Positive supply voltage |
| 핀 11 | RB0 — Bidirectional I/O / interrupt-on-change |
| 핀 12 | RB1 — Bidirectional I/O / interrupt-on-change |
| 핀 13 | RB2 — Bidirectional I/O / interrupt-on-change |
| 핀 14 | RB3 — Bidirectional I/O / interrupt-on-change |
| 핀 15 | RB4 — Bidirectional I/O / interrupt-on-change |
| 핀 16 | RB5 — Bidirectional I/O / interrupt-on-change |
| 핀 17 | RB6 — Bidirectional I/O / ICSPCLK |
| 핀 18 | RB7 — Bidirectional I/O / ICSPDAT |
| 핀 19 | RC0 — Bidirectional I/O |
| 핀 20 | RC1 — Bidirectional I/O |
| 핀 21 | RC2 — Bidirectional I/O |
| 핀 22 | RC3 — Bidirectional I/O |
| 핀 23 | RC4 — Bidirectional I/O |
| 핀 24 | RC5 — Bidirectional I/O |
| 핀 25 | RC6 — Bidirectional I/O / TX/CK |
| 핀 26 | RC7 — Bidirectional I/O / RX/DT |
| 핀 27 | MCLR/VPP — Master clear reset / programming voltage |
| 핀 28 | AVDD — Analog positive supply (tie to VDD) |
일반적인 애플리케이션
PIC16LF15356T-E/MVVAO 적합 용도: 6 애플리케이션s: Automotive LIN Sensor Nodes, IoT Sensor Hubs and Edge Nodes, Industrial HVAC Control Modules, Automotive Interior Lighting Controllers, Portable Medical Monitoring Devices, Small Industrial HMI and Keypad Controllers.
Automotive LIN Sensor Nodes
The PIC16LF15356T-E/MVVAO is purpose-built for automotive LIN (Local Interconnect Network) sensor nodes. Its dual EUSART blocks support LIN 2.x master and slave protocols, while the automotive -40C to +125C temperature grade and AEC-Q100 testing make it qualified for under-hood and body-electronics deployments. The 4x 10-bit PWMs can directly drive actuator coils or LED indicators, while the 10-bit ADC2 with computation handles temperature, pressure, and position sensor reads with hardware averaging. With 28KB Flash and 2KB SRAM, the device fits LIN stacks plus application logic with room for bootloader and diagnostic logging. The 1.8-3.6V LF supply aligns with 12V automotive rail post-regulation, and XLP sleep currents below 1 uA support always-on nodes without draining the battery.
추천
IoT Sensor Hubs and Edge Nodes
For battery-powered IoT edge nodes, the PIC16LF15356T-E/MVVAO combines eXtreme Low-Power (XLP) sleep operation below 1 uA with sufficient compute to coordinate sensors and a host radio. The 28KB Flash accommodates wireless stacks such as LoRaWAN or BLE beaconing firmware, while the dual SPI interfaces allow simultaneous connection to a sensor front-end and an SPI radio module. The 10-bit ADC2 with built-in averaging and threshold detection can run autonomously via the ADC2 Computation mode, waking the core only when meaningful events occur. The 28-UQFN 4x4 mm package supports compact wearable or coin-cell designs where PCB real estate is at a premium.
추천
Industrial HVAC Control Modules
In HVAC control modules, the PIC16LF15356T-E/MVVAO drives multiple 10-bit PWM outputs for damper and valve actuators while monitoring temperature and pressure via the ADC2 peripheral. Its 4x PWM channels provide independent control of variable-speed fans, blend doors, and compressor staging without requiring an external motor-control IC. The dual EUSART blocks support RS-485 industrial bus communications for building automation integration. The 28KB Flash accommodates HVAC control algorithms plus a modifiable firmware update path, while the 2KB SRAM supports sensor-fusion buffers and PID loop state. The automotive temperature grade ensures long-term reliability in rooftop or basement equipment.
추천
Automotive Interior Lighting Controllers
The PIC16LF15356T-E/MVVAO is well-suited for automotive ambient interior lighting, courtesy lighting, and RGB controller modules. Its 4x 10-bit PWM outputs can drive multiple LED channels with smooth dimming transitions, while the 8-bit DAC provides analog reference levels for current-mode LED drivers. The Complementary Waveform Generator (CWG) can produce dead-band-controlled complementary PWM pairs needed for half-bridge LED driver topologies. Automotive AEC-Q100 qualification and the LF variant's low standby current enable always-on dimming memory functions without taxing the vehicle battery.
추천
Portable Medical Monitoring Devices
For portable medical monitoring devices such as pulse oximeters, glucose meters, and wearable health patches, the PIC16LF15356T-E/MVVAO delivers deterministic real-time performance with low power consumption. The 10-bit ADC2 with computation handles PPG or bio-impedance signal acquisition with on-chip averaging, freeing the core for BLE comms and user interface tasks. The LF variant's XLP technology supports weeks-long battery life through deep-sleep wake-on-event operation. The 28-UQFN package allows compact wearable form factors, and the PIC16 enhanced core's deterministic interrupt latency is critical for time-sensitive medical measurements.
추천
Small Industrial HMI and Keypad Controllers
The PIC16LF15356T-E/MVVAO serves as a robust front-panel controller for industrial human-machine interfaces (HMIs), membrane keypads, and rotary encoder inputs. The dual I2C and dual SPI buses allow connection to a graphical OLED or character LCD plus a capacitive touch controller simultaneously, while the 26 GPIO pins handle matrix-scanned keypads up to 5x5 plus indicator LEDs. The CWG peripheral generates tone alerts or buzzer signals without core overhead. Industrial-grade siblings such as PIC16LF15356-I/ML are appropriate for non-automotive factory-floor deployments, and the 4x PWM channels can directly drive LCD backlight brightness via analog dimming.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC16LF15356T-E/MVVAO — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC16LF15356-I/ML | PIC16LF15355-I/MV | PIC16LF15356-E/MVVAO | PIC16F15356T-E/MVVAO | PIC16LF15354-I/MV |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-UQFN (4x4 mm) | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same |
| Program Memory (Flash) | 28 KB | 28 KB | 14 KB | 28 KB | 28 KB | 7 KB |
| Data Memory (SRAM) | 2 KB | 2 KB | 1 KB | 2 KB | 2 KB | 512 B |
| Operating Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 5.5 V | 1.8 V to 3.6 V |
| Temperature Grade | Automotive -40C to +125C | Industrial -40C to +85C | Industrial -40C to +85C | Automotive -40C to +125C | Automotive -40C to +125C | Industrial -40C to +85C |
| Number of I/O | 26 | 26 | 26 | 26 | 26 | 26 |
| PWM Channels | 4 x 10-bit | 4 x 10-bit | 4 x 10-bit | 4 x 10-bit | 4 x 10-bit | 4 x 10-bit |
| Communication Peripherals | 2x EUSART, 2x SPI, 2x I2C | 2x EUSART, 2x SPI, 2x I2C | 2x EUSART, 2x SPI, 2x I2C | 2x EUSART, 2x SPI, 2x I2C | 2x EUSART, 2x SPI, 2x I2C | 2x EUSART, 2x SPI, 2x I2C |
주요 차별점
- Automotive-grade AEC-Q100 qualification with -40C to +125C extended temperature (vs PIC16LF15356-I/ML)
- eXtreme Low-Power (XLP) LF variant with sub-uA sleep current (vs PIC16F15356T-E/MVVAO)
- 28KB Flash with 2KB SRAM at automotive temperature grade (vs PIC16LF15355-I/MV)
설계 노트
The 28-UQFN package's exposed pad (EP) is the primary thermal dissipation path. The PCB land pattern MUST include a copper pour directly beneath the EP, stitched to the ground plane with multiple thermal vias (typically 0.3 mm drill, 0.6 mm pad, 9-16 vias in a 3x3 or 4x4 array). For automotive applications operating continuously at 32 MHz with all peripherals active, a minimum 100 mm2 EP copper pour on the top layer (more on inner/ground layers) is recommended to keep junction temperature within the -40C to +125C envelope.
Estimated: total power dissipation at 32 MHz, 3.3V, all peripherals active, is approximately 15 mW. Add a 100 nF ceramic decoupling capacitor as close as possible to each VDD pin and a bulk 4.7 uF to 10 uF tantalum or ceramic on the main 3.3V rail. Place an additional 10 nF and 100 nF pair on AVDD if the ADC2 is used for precision measurements. A ferrite bead in series with AVDD can improve ADC noise immunity by isolating analog and digital supplies.
Route the ICSP signals (MCLR/VPP, ICSPCLK, ICSPDAT) to a 5-pin header or pogo-pad footprint accessible from the board edge. Use series resistors (typically 4.7 kohm) on MCLR to limit inrush current during programming. Keep the 32 MHz crystal or external oscillator traces short (under 5 mm) and surrounded by a ground guard ring. If using the internal oscillator, verify the calibrated accuracy across your operating temperature range - the factory-calibrated HFINTOSC is typically +/-2% across -40C to +125C.
Do not leave the MCLR pin floating - tie it to VDD through a 10 kohm pull-up resistor, or to a controlled reset supervisor. Configure unused GPIO as outputs driven low to minimize current consumption. The LF variant's maximum VDD is 3.6V - applying 5V will permanently damage the device. When migrating from PIC16F15356 to PIC16LF15356, verify that your existing firmware does not assume 5V I/O tolerance; LF GPIO are NOT 5V-tolerant.
For LIN bus implementation, use the EUSART in LIN master or slave mode and ensure the baud-rate error is below +/-2%. Place the LIN transceiver IC adjacent to the MCU with a short trace (<10 mm) from the EUSART TX/RX pins to the transceiver. Add a 1 nF capacitor on the LIN bus line near the transceiver for EMI suppression. For SPI connections to high-speed sensors or displays, route the clock line with controlled impedance and add a series 33 ohm resistor near the driver to dampen reflections if the bus length exceeds 50 mm.
규정 준수 정보
RoHS compliant per Microchip product page. The /E grade and /MVVAO packaging suffix denote AEC-Q100 automotive qualification. Halogen-free status should be confirmed against the latest Microchip material declaration.
