MC9RS08LA8CFT
MC9RS08LA8CFT - 20MHz RS08 MCU with 8KB Flash | NXP
The NXP Semiconductors MC9RS08LA8CFT is an 8-bit RS08 microcontroller with 20 MHz processing, 8 KB of Flash program memory, 256 bytes of RAM, 31 I/O pins, and a 48-pin QFN exposed-pad package. It operates from 3.3 V or 5 V and is designed for cost-sensitive embedded systems requiring integrated LCD-driving capability.
A microcontroller is a programmable system-on-chip that integrates a CPU, memory, input/output ports, and peripherals into one device. The RS08 family belongs to the 8-bit microcontroller hierarchy, where the CPU executes compact embedded-control firmware while interacting directly with sensors, displays, relays, and communication interfaces. The LA family specifically targets small appliances, medical equipment, and industrial or multi-market products.
Verified device data identifies an 8-bit RS08 CISC core, 8 KB (8K x 8) Flash memory, 256 x 8 RAM, 31 I/O pins, a 20 MHz maximum speed, an internal oscillator, and a 48-VFQFN exposed-pad package. The integrated LCD driver and charge-pump capability support display-oriented designs while reducing external support circuitry. The verified snippets also identify 3.3 V/5 V operation and tray packaging.
The 20 MHz RS08 core provides sufficient control bandwidth for keypad scanning, display updates, sensor acquisition, and state-machine-based appliance control. Its 8-bit architecture simplifies instruction handling and supports economical embedded firmware. Exact peripheral inventory, memory map, interrupt behavior, ADC information, and detailed electrical limits are not available in the supplied source snippets and should be confirmed in the manufacturer datasheet.
Typical applications include small appliances, medical equipment, industrial control panels, and other multi-market embedded systems. The LCD-oriented integration is particularly relevant where a compact display, keypad interface, and local control logic are needed without relying on a higher-cost MCU. The exposed thermal pad improves heat transfer on multilayer PCBs when the device dissipates power.
Designers should treat the part as an end-of-life MCU and verify availability before starting a new production design. Firmware, memory map, LCD segment configuration, bypass capacitors, oscillator settings, and exposed-pad soldering must follow the official datasheet. For new designs, assess current NXP or other MCU families rather than assuming this obsolete device is a safe long-term choice.
This page combines verified manufacturer and distributor information, availability context, package details, and engineering cautions. It is intended to help engineers identify whether the MC9RS08LA8CFT fits an existing embedded design while clearly separating verified facts from parameters that require datasheet confirmation.
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