MC9S12B64MPVE
MC9S12B64MPVE - 16-Bit 25MHz 64KB MCU | NXP
The NXP Semiconductors MC9S12B64MPVE is a 16-bit HCS12 microcontroller with an S12 core, 25 MHz operation, 64 KB of flash memory, and a 112-pin LQFP package measuring 20 mm by 20 mm. It is positioned for automotive and industrial embedded-control designs that require deterministic control processing and broad peripheral integration. The supplied distributor records conflict on maximum frequency, identifying the device as both 25 MHz and 50 MHz; the NXP product page and technical summaries identify 25 MHz, while the higher figure is retained only as a reported distributor discrepancy.
A microcontroller is a semiconductor device that executes firmware, reads inputs, controls outputs, and coordinates peripherals within an embedded system. The HCS12 MC9S12B64 belongs to the broader hierarchy of 16-bit MCU, embedded processor, embedded-control IC, and semiconductor. Its flash-based architecture supports standalone control applications without an external program-memory device, while the large 112-pin package exposes substantially more I/O and peripheral connections than a small 32-pin or 48-pin MCU.
Verified features include a 16-bit S12 core, 64 KB organized as 64K by 8 bits of flash, and a -40 °C to +125 °C operating-temperature range. The package is identified as 112-pin LQFP in a 20 mm by 20 mm body. One aggregation source identifies the device as CMOS, with a 260 °C peak reflow temperature, 40-second maximum peak-reflow exposure, MSL 3, and tin terminal finish. These process attributes matter when selecting assembly process and handling components after opening moisture-sensitive packaging.
Typical uses include automotive body, multiplexing, sensor, actuator, and communication-control modules. The broad temperature range supports harsh industrial environments, while the 64 KB flash capacity accommodates embedded control firmware and application data. Exact RAM capacity, peripheral inventory, supply voltage, ADC performance, timer resources, communication modules, and individual pin functions were not supplied in the verified dataset and therefore must be confirmed from the manufacturer datasheet before schematic capture.
Designers should use the 112-pin package only when the required I/O and peripheral mix justifies its footprint. Confirm every pin, alternate function, power pin, ground pin, decoupling requirement, and programming interface against the official documentation. For a new PCB, also evaluate smaller active HCS12 devices that may meet the actual memory and I/O needs; for an existing MC9S12B64 design, lifecycle and sourcing constraints should be addressed explicitly.
This page consolidates the supplied manufacturer and distributor records, separates conflicting frequency claims, identifies sourcing and lifecycle concerns, and provides engineering-focused selection guidance. Detailed pricing, complete pinout, and verified drop-in replacement MPNs were not available, so this synthesis avoids presenting unsupported values as production-ready design data.
견적 요청
문의하기