ATTINY167-AXD
ATTINY167-AXD - 8-bit AVR MCU, 16KB Flash, 20MHz, TSSOP-20 | Microchip
The Microchip (formerly Atmel) ATTINY167-AXD is an 8-bit AVR RISC-based microcontroller featuring 16KB In-System Programmable Flash, 512B EEPROM, and 512B SRAM, clocked up to 20 MHz, housed in a 20-pin TSSOP package. The device integrates a hardware LIN/UART controller, full-speed USB 2.0 device interface, 16 general-purpose I/O lines, 32 working registers, and a 10-bit ADC, delivering automotive-grade connectivity for embedded LIN nodes and USB peripherals.
An 8-bit microcontroller (MCU) is a compact processor that integrates a CPU core, non-volatile program memory, volatile data memory, and peripheral interfaces on a single silicon die. The AVR family uses a modified Harvard architecture with single-cycle instruction execution, making 8-bit MCUs well suited for deterministic, low-power, real-time control tasks. Within the broader semiconductor taxonomy, MCUs belong to the embedded processor category, with 8-bit parts occupying the low-power, cost-sensitive end versus 16-bit and 32-bit MCUs that target higher computational throughput. The ATTINY167-AXD specifically adds automotive bus (LIN) and USB connectivity, a combination rarely found in 8-bit parts, while remaining in a small TSSOP-20 footprint.
Key features include 16KB flash (8K x 16 words), 512B EEPROM for non-volatile data, 512B SRAM, hardware LIN 2.0 controller, USB 2.0 full-speed device, 10-bit ADC with up to 11 channels, 8-bit and 16-bit timers with PWM, an enhanced universal serial interface (USI), and a programmable watchdog timer with separate on-chip oscillator. The MCU operates from 1.8V to 5.5V across -40C to +125C (automotive grade), and supports in-system programming via SPI or USB, enabling field firmware upgrades without desoldering.
The device uses Microchip's enhanced AVR RISC core executing instructions in a single clock cycle, achieving up to 20 MIPS throughput at 20 MHz. Hardware LIN handling offloads bit timing and checksum generation from the CPU, freeing cycles for application logic. The integrated USB transceiver and dedicated 3.3V regulator simplify USB device designs by eliminating external PHY or LDO components. The TSSOP-20 package balances IO count with a 6.5mm x 4.4mm board footprint, smaller than the SOIC-20 alternative.
Typical applications include automotive LIN slave nodes (body controllers, seat modules, mirror controllers, sensor clusters), USB human-interface devices (HID mice, keyboards, custom peripherals), industrial sensor transmitters, and low-cost consumer devices requiring automotive temperature tolerance. The wide operating voltage and temperature range also make it suitable for harsh-environment IoT edge nodes.
When designing with this device, prioritize decoupling: place a 100nF ceramic capacitor on each VCC pin within 2mm of the pad, and add a 10uF bulk capacitor near the USB VBUS line. For LIN applications, route the LIN line as a differential pair with the bus pull-up, and add TVS protection such as the NUP2105L. Always configure the fuses for the intended clock source (internal 8 MHz RC vs external crystal) before USB enumeration.
This page synthesizes distributor pricing, drop-in compatible alternatives within the TSSOP-20 footprint, and practical automotive design notes not collected on a single manufacturer datasheet page.
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