ATSAMV70Q20B-CB - ARM Cortex-M7 300MHz MCU, 1MB Flash | Microchip
부품 번호: ATSAMV70Q20B-CB ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $17.31 | $17.31 |
| 10 | $16.04 | $160.40 |
| 100 | $14.2 | $1,420.00 |
| 500 | $12.6 | $6,300.00 |
| 1,000 | $11.05 | $11,050.00 |
| 3,000 | $9.85 | $29,550.00 |
ATSAMV70Q20B-CB 개요
An ARM Cortex-M7 MCU is a 32-bit microcontroller built on the ARMv7-M architecture with a deeply pipelined core that delivers 2.14 CoreMark/MHz performance, a hardware double-precision floating-point unit, single-precision and double-precision SIMD instructions, and tightly-coupled memory for low-latency code and data access. It sits within the broader taxonomy of MCU -> embedded microcontroller -> SoC -> semiconductor. The Cortex-M7 family supersedes Cortex-M4 by adding cache controllers, branch prediction, and dual-issue capability, making it the highest-performance mainstream Cortex-M part before moving into Cortex-M33/M55 secure islands.
Key features include 1 MB (1M x 8) embedded Flash, 384 KB of multi-port SRAM, an MPU for memory protection, 16-bit SDRAM and 8/16-bit PSRAM external bus interface, an image sensor interface, an advanced 16-bit sigma-delta ADC with up to 24 channels, and a hardware crypto accelerator (TRNG, AES, SHA, RSA). The on-chip peripherals include 8-bit/16-bit image sensor interface (ISI), 12-bit DAC, 16-bit timers, PWM, I2S, I2C, SPI, UART/USART, and high-speed USB with integrated PHY. The 144-TFBGA package offers compact 10x10 mm footprint while exposing up to 88 GPIOs.
The architectural depth of SAM V70 lies in its Cortex-M7 core, which integrates an L1 instruction cache and branch target address cache to mitigate Flash wait-state penalties at 300 MHz, while the multi-port SRAM bank allows parallel DMA, Ethernet, and code execution without bus contention. The peripheral event system (PDMA, AFEC) and an interrupt controller with configurable priorities allow deterministic sub-microsecond response on critical tasks such as motor control or CAN-FD message handling. An integrated flexible 8- to 16-bit external bus interface (EBI) simplifies expansion to SDRAM or QSPI Flash.
Typical applications include automotive body controllers, HVAC panels, LED matrix drivers, industrial PLCs, motor-control front-ends, and IoT gateways that require Ethernet + CAN-FD co-existence. The device is also a strong fit for human-machine-interface (HMI) panels with TFT-LCD support, audio infotainment nodes, and CAN/LIN gateways. When designing with this part, designers should provision an external LDO or DC-DC for the 1.2V core rail and follow Microchip's Atmel Studio/Microchip Studio pin-mux configuration to avoid peripheral conflict on shared I/O lines. The part uses an automotive-grade process and is PPAP-capable.
드롭인 대체품: ATSAMV70Q20B-CB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAMV70Q20B-CB (동일 폼 팩터 및 풋프린트) — 차이점: ADC, Package, Ethernet, Operating Temperature, Core.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAMS70Q21B-ANT
✅ 드롭인✓ 재고 있음
$15.85 / 개
데이터시트 보기 →ATSAMS70Q20A-AN
✅ 드롭인✓ 재고 있음
$9.52 / 개
데이터시트 보기 →ATSAME70Q21B-AN
✅ 드롭인✓ 재고 있음
$17.4 / 개
데이터시트 보기 →ATSAME70Q21A-CNT
✅ 드롭인✓ 재고 있음
$8.2 / 개
데이터시트 보기 →ATSAME70N20A-AN
✅ 드롭인✓ 재고 있음
$11.2 / 개
데이터시트 보기 →ATSAMV70Q20B-CB 최대 정격 & 전기적 특성
| Core | ARM Cortex-M7 with single-precision and double-precision FPU |
| 최대 클록 주파수 | 300 MHz |
| Program Memory Size | 1 MB (1M x 8) Flash |
| SRAM Size | 384 KB |
| Operating Voltage Range | 3.0 V to 3.6 V |
| 패키지 | 144-pin TFBGA, 10x10 mm |
| 실장 유형 | Surface Mount |
| Series | Automotive, AEC-Q100, SAM V70 |
| ADC | 16-bit sigma-delta, up to 24 channels |
| DAC | 12-bit |
| Communication Interfaces | Ethernet, CAN-FD, USB, I2S, SPI, I2C, UART, HSMCI |
| 동작 온도 | -40C to +105C (automotive grade) |
| AEC-Q100 Qualified | Yes |
| External Memory Bus | EBI (SDRAM/PSRAM, 8/16-bit) |
| Image Sensor Interface | Yes, 8/16-bit ISI |
| Cryptography | TRNG, AES, SHA, RSA accelerators |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
ATSAMV70Q20B-CB 144-pin tfbga, 10x10 mm 핀 구성 가이드
ATSAMV70Q20B-CB(144-pin tfbga, 10x10 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAMV70Q20B-CB.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAMV70Q20B-CB 적합 용도: 6 애플리케이션s: Automotive Body Control Module (BCM), Automotive Gateway ECU (CAN-FD to Ethernet), Industrial Motor Control (BLDC/PMSM FOC), Human-Machine Interface (HMI) with TFT-LCD, IoT Edge Gateway with Ethernet + USB, Automotive Infotainment Audio Node.
Automotive Body Control Module (BCM)
The ATSAMV70Q20B-CB is a strong fit for automotive body control modules thanks to its AEC-Q100 qualification, 1 MB Flash for complex state machines, and 384 KB SRAM for simultaneous CAN-FD and Ethernet processing. The 300 MHz Cortex-M7 core provides deterministic interrupt response under the heavy message load typical of BCM ECUs, and the 144-TFBGA footprint exposes the 88 GPIOs needed to drive lighting, mirror fold, and door-lock actuators. Designers typically pair the part with a TJA1057 CAN-FD transceiver and a DP83848 Ethernet PHY. Compared with legacy Cortex-M3 BCM chips, the V70 family delivers roughly 2x CoreMark per MHz and adds hardware AES/SHA crypto for secure OTA update support.
추천
Automotive Gateway ECU (CAN-FD to Ethernet)
The ATSAMV70Q20B-CB's simultaneous Ethernet MAC and CAN-FD support make it well-suited for next-generation automotive gateway ECUs that bridge legacy CAN bus and high-bandwidth Ethernet backbones. The Cortex-M7 core runs AUTOSAR MCAL at 300 MHz while the dedicated DMA channels handle CAN-FD and Ethernet traffic without CPU bottleneck. The integrated hardware crypto accelerators (AES, SHA, RSA) and TRNG provide the secure-boot and message-authentication primitives demanded by modern gateway designs. A typical implementation pairs the V70 with an external Ethernet PHY (DP83848) and a CAN-FD transceiver (TJA1057), plus a small SDRAM on the EBI bus for packet buffering at line rate.
추천
Industrial Motor Control (BLDC/PMSM FOC)
Industrial motor-control designs benefit from the ATSAMV70Q20B-CB's Cortex-M7 with double-precision FPU, which executes field-oriented control (FOC) algorithms with sub-microsecond loop times for BLDC and PMSM motors. The 16-bit sigma-delta ADC and 12-bit DAC enable precision current sensing and analog reference generation, while PWM timers provide dead-time-correct complementary outputs for 3-phase inverter bridges. The 384 KB SRAM holds control-loop working data plus speed/position estimators, and 1 MB Flash stores firmware updates with ECC protection. For industrial (non-automotive) applications the ATSAME70Q21B-AN can be used as a lower-cost industrial-grade substitute with identical motor-control performance.
추천
Human-Machine Interface (HMI) with TFT-LCD
The ATSAMV70Q20B-CB's integrated image sensor interface (ISI), TFT-LCD controller, and 1 MB Flash make it well-matched to HMI designs with 4-7 inch TFT displays in automotive instrument clusters, HVAC panels, and industrial touchscreens. The Cortex-M7 renders graphics with hardware acceleration (2D DMA overlays) while external SDRAM on the EBI bus holds framebuffers without burdening internal SRAM. The hardware crypto accelerators protect against unauthorized GUI firmware replacement. Compared with M4-based HMI chips, the V70 family delivers smoother 60 fps refresh with a smaller firmware footprint thanks to higher code density on the M7 pipeline.
추천
IoT Edge Gateway with Ethernet + USB
IoT edge gateways that aggregate Modbus, MQTT, and CAN traffic benefit from the ATSAMV70Q20B-CB's Ethernet MAC, USB 2.0 High-Speed PHY, and 1 MB Flash for protocol stacks (TLS, MQTT-SN, OPC-UA). The Cortex-M7's deterministic interrupt handling ensures protocol deadlines are met even under combined load. The 144-TFBGA package supports 88 GPIOs for multiple sensor interface ports (RS-485, RS-232, SPI, I2C), and the integrated crypto block handles TLS handshakes without external acceleration. Compared with lower-end Cortex-M4 gateways, the V70 reduces per-message processing latency by 40-60% on TLS handshakes.
추천
Automotive Infotainment Audio Node
The ATSAMV70Q20B-CB integrates an I2S interface, 12-bit DAC, and Cortex-M7 DSP extensions (single-precision SIMD) that suit automotive infotainment audio nodes such as amplifier control, ANC microphone pre-processing, and chime generators. The 300 MHz core executes audio DSP algorithms (biquad filters, RMS detection) while Ethernet transports audio streams to the head unit. The 1 MB Flash stores voice-prompt libraries and the 384 KB SRAM provides delay-line memory for ANC. AEC-Q100 qualification lets it mount directly in cabin or head-unit sub-modules without additional isolation circuitry.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAMV70Q20B-CB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAMS70Q21B-ANT | ATSAMS70Q20A-AN | ATSAME70Q21B-AN | ATSAME70Q21A-CNT | ATSAME70N20A-AN |
|---|---|---|---|---|---|---|
| Package | 144-TFBGA (10x10 mm) | 144-LQFP (20x20 mm) | 144-LQFP | 144-LQFP | 144-TFBGA (10x10 mm) | 144-LQFP |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU | ARM Cortex-M7 with FPU |
| Maximum Clock Frequency | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz |
| AEC-Q100 Qualified | Yes (Grade 2) | Yes | Yes | No (industrial) | No (industrial) | No (industrial) |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) |
주요 차별점
- Automotive AEC-Q100 qualification with industrial-grade die reuse (vs ATSAME70Q21B-AN)
- Highest-density SAM V70 variant in 144-TFBGA (vs ATSAMS70Q21B-ANT)
- Integrated hardware crypto accelerators (AES/SHA/RSA/TRNG) (vs ATSAMS70Q21B-ANT)
설계 노트
The ATSAMV70Q20B-CB requires a clean 3.3V I/O rail and a separate 1.2V core rail; Microchip recommends an LDO with at least 200 mA continuous rating for VDDIO and a switching DC-DC for VDDCORE to manage efficiency at 300 MHz full load. Place 100 nF decoupling capacitors on every VDD pin and a 4.7 uF bulk capacitor on the 3.3V rail within 10 mm of the package. Use separate analog (VDDANA) and digital grounds stitched together only at one point beneath the chip. Power-on-reset timing follows the 1.2V core rail; ensure the core rail settles before the I/O rail rises to avoid latch-up during startup.
Estimated: the 144-TFBGA package has a theta-JA of approximately 25 C/W on a 4-layer 1oz JEDEC test board. At 300 MHz full-clock load with all peripherals active, the V70 typically dissipates 0.5-0.8 W, yielding a 12-20 C junction rise above ambient. For automotive under-hood placements (Ta up to 85 C), thermal rise to roughly 105 C Tjmax is acceptable. Above 0.8 W continuous dissipation, add thermal vias under the exposed pad and consider copper pour on both sides of the PCB tied to the central ball array.
Common pitfalls: (1) Forgetting to configure the AFEC impedance setting when using the 16-bit sigma-delta ADC, which can halve effective resolution. (2) Driving the same I/O line from two peripheral functions without disabling the unused function in the MATRIX/PIO mux controller, which causes contention and elevated supply current. (3) Using the integrated USB PHY without a 90-ohm differential pair routed as impedance-controlled traces, which fails USB-IF compliance. (4) Configuring the EBI bus to SDRAM without setting correct chip-select timing registers, which manifests as intermittent read corruption.
Route the high-speed Ethernet MII/RMII traces as 50-ohm single-ended controlled-impedance lines with matched lengths under 5 mm delta. The DDR-capable EBI bus to external SDRAM requires matched length tuning within 50 ps; use a serpentine on data byte lanes to meet setup/hold. Place the 12 MHz crystal within 5 mm of XIN/XOUT with the load capacitors (per datasheet XO load capacitance, typically 12 pF) tied to analog ground. Keep the high-speed USB DP/DN pair as an 90-ohm differential pair with no vias, and isolate it from analog ADC traces by ground stitching every 5 mm.
규정 준수 정보
AEC-Q100 Grade 2 qualification per Microchip product page; RoHS compliant per part datasheet. Halogen-free status not explicitly stated in provided data.
