10AS032H2F34I2SG vs 10AS032H2F34E2LG 비교
다음의 상세 나란히 비교: 10AS032H2F34I2SG 제조: Intel 및 10AS032H2F34E2LG 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | 10AS032H2F34I2SG | 10AS032H2F34E2LG |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $3,760.00 | $1,380.00 |
| Family | Arria 10 SX | Arria 10 SX |
| Logic Elements | 320,000 | 320,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Clock Speed (max) | 1.5 GHz | — |
| On-chip RAM (HPS) | 256 KB | — |
| Process Technology | 20 nm | — |
| Core Voltage | 0.9 V | — |
| 패키지 | 1152-FBGA, FC (35x35 mm) | 1152-ball FC-FBGA (F34), 35 x 35 mm |
| 실장 유형 | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| Operating Temperature Grade | Industrial | — |
| RoHS 상태 | Compliant | Compliant |
| Lead-Free | Yes | — |
| Configuration | System-on-Chip (SoC) FPGA | SoC FPGA (HPS + FPGA fabric) |
| Number of Terminals | 1152 (BGA) | — |
| Package Code | BGA (Square, Flip-Chip) | — |
| Device Tier | — | 10AS032 (mid-density) |
| Processor Subsystem | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Operating Frequency | — | 1.5 GHz |
| Speed Grade | — | 2 |
| Temperature Grade | — | E2 (commercial/extended) |
| On-chip Memory (M20K blocks) | — | Approx. 21 Mb [DATA_NEEDED: exact Mb from datasheet] |
| DSP Blocks | — | Variable-precision, IEEE 754 single-precision FP support |
| Transceivers | — | Up to 14.1 Gbps [DATA_NEEDED: exact count for F34 package] |
| Memory Controller Hard IP | — | DDR4, DDR3, QDRII+, RLDRAM3 |
| Process Node | — | 20 nm |
| Form of Terminal | — | Ball (BGA) |
| Terminal Pitch | — | 1 mm |