10AX115U2F45E2SG vs 10AX115U3F45E2SG 비교
다음의 상세 나란히 비교: 10AX115U2F45E2SG 제조: Intel 및 10AX115U3F45E2SG 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | 10AX115U2F45E2SG | 10AX115U3F45E2SG |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $6,920.66 | $5,800.00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 1,150,000 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory Bits | 68,857,560 | 68,857,856 (≈ 52.99 Mbit) |
| Embedded Memory Blocks | 2,134 M20K blocks (approx.) | — |
| DSP Blocks | 1,518 (variable-precision, hardened FP) | Variable-precision, hardened floating-point |
| User I/Os | 480 | — |
| Transceivers | Up to 24 (GX, 12.5 Gbps) | — |
| PCIe Hard IP | Gen3 x8 | — |
| Memory Interfaces | DDR4, QDR-IV, RLDRAM3 | — |
| Process Node | 20 nm | 20 nm Tri-Gate (Intel) |
| Speed Grade | 2 | -2 (E2 commercial/extended) |
| Temperature Grade | E2 (industrial) | — |
| 패키지 | 1932-ball FCBGA (45 mm) | 1932-ball FCBGA (F45, 45×45 mm, 1.0 mm pitch) |
| 실장 유형 | Surface Mount | — |
| RoHS 상태 | Compliant | — |
| Configuration Memory | SRAM-based (volatile, requires config device) | — |
| Logic Elements (LE) | — | 1,150,000 |
| Adaptive Logic Modules (ALM) | — | 427,200 |
| Number of Transceivers | — | [DATA_NEEDED: per-die transceiver count, F45 package variant] |
| Maximum Transceiver Data Rate | — | 17.4 Gbps |
| Hard Memory Controllers | — | 2 (DDR4/DDR3/QDRII+/RLDRAM3) |
| Hard PCIe Gen3 IP Blocks | — | 2 × PCIe Gen3 (x8/x4/x2/x1) |
| 동작 온도 | — | Industrial (junction -40 °C to +100 °C) – device grade U |
| Supply Voltage Core | — | [DATA_NEEDED: VCC/VCCP core voltage] |
| Configuration Method | — | FPGA configuration via serial/parallel flash, JTAG |
| RoHS Compliance | — | Compliant |
| MSL 레벨 | — | [DATA_NEEDED: MSL rating per JEDEC J-STD-020] |