5CSEBA4U23C7N vs 5CSEBA4U23C6N 비교
다음의 상세 나란히 비교: 5CSEBA4U23C7N 제조: Intel 및 5CSEBA4U23C6N 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | 5CSEBA4U23C7N | 5CSEBA4U23C6N |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $124.50 | $86.20 |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE SoC FPGA |
| Device Variant | 5CSEA4 (Logic Element density) | — |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| Logic Elements | 40,000 | 40,000 |
| HPS Maximum Core Frequency | 800 MHz | — |
| DSP Blocks (18x18) | 224 | — |
| Embedded Memory | Approximately 2.7 Mbits (M10K + M9K) | — |
| 패키지 | 672-ball UBGAs (UBGA), 23x23 mm | 672-pin UFBGA / UBGA, 23 x 23 mm, 0.8 mm pitch |
| Core Voltage | 1.1 V | — |
| User I/O Count | 364 | — |
| High-Speed Transceivers | 6 (up to 3.125 Gbps) | — |
| PCIe Hard IP | 2 Gen2 blocks | — |
| 동작 온도 | Commercial 0C to +85C (C7 speed grade) | — |
| 실장 유형 | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS 상태 | Compliant | Compliant |
| Process Technology | TSMC 28 nm low-power | TSMC 28 nm low-power |
| HPS Memory Interface | DDR3, DDR3L, LPDDR2 (16-bit + ECC option) | — |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory (M10K + MLAB) | — | 2,460 Kbits |
| DSP Blocks (18x18 Multipliers) | — | 112 |
| HPS Processor Cores | — | Dual ARM Cortex-A9 MPCore |
| HPS Maximum CPU Clock | — | 925 MHz |
| Hard Memory Controller | — | DDR3 / DDR3L / LPDDR2 |
| Core Voltage (VCC) | — | 1.1 V |
| General-Purpose FPGA I/Os | — | 188 |
| Transceivers | — | Not integrated on SE device |
| 동작 접합 온도 | — | -40 C to +100 C (typical SE spec; exact C6 grade per datasheet) |
| Configuration Modes | — | JTAG (IEEE 1149.1), Active Serial (AS) via EPCS/EPCQ |