A3P600-1FG256 vs M7AFS600-1FGG256 비교
다음의 상세 나란히 비교: A3P600-1FG256 제조: Microchip Technology 및 M7AFS600-1FGG256 제조: Microchip Technology. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Microchip Technology
M7AFS600-1FGG256 - Fusion 600K Gate Mixed-Signal FPGA | Microchip
M7AFS600-1FGG256 Nrnd사양 비교
| 파라미터 | A3P600-1FG256 | M7AFS600-1FGG256 |
|---|---|---|
| 브랜드 | Microchip Technology | Microchip Technology |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | NRND |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $51.28 | $92.00 |
| FPGA Family | ProASIC3 | — |
| System Gates | 600000 | 600K |
| Max System Performance | 272 MHz | — |
| Process Technology | 130nm CMOS | 130 nm flash |
| Core Supply Voltage | 1.5 V | 1.5 V |
| User I/O Count | 177 | — |
| I/O Banks | 4 | — |
| Total RAM Bits | 110592 bits | — |
| 패키지 / 케이스 | 256-LBGA (FBGA-256) | — |
| 핀 수 | 256 | — |
| 동작 온도 범위 | 0°C to 70°C | — |
| 실장 유형 | Surface Mount | Surface Mount |
| Configuration Memory | Flash-based (non-volatile) | — |
| Logic Elements / VersaTiles | [DATA_NEEDED: Logic elements/VersaTiles] | — |
| Embedded Flash Size | [DATA_NEEDED: Embedded flash size] | — |
| Supported I/O Standards | [DATA_NEEDED: Supported I/O standards] | — |
| RoHS 상태 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| MSL 레벨 | [DATA_NEEDED: MSL level] | [DATA_NEEDED: moisture sensitivity level] |
| Family | — | Fusion (Mixed-Signal FPGA) |
| Fabric Elements (Registers) | — | 110592 |
| Embedded Processor | — | 32-bit ARM CoreMP7 (hard core) |
| Speed Grade | — | -1 |
| 패키지 | — | 256-LBGA (FPBGA-256, 17x17 mm) |
| Configuration | — | Flash-based, nonvolatile, live at power-up |
| 동작 온도 | — | 0C to +70C (commercial) |
| Maximum Frequency | — | [DATA_NEEDED: maximum fabric/system frequency] |
| Number of I/O | — | [DATA_NEEDED: user I/O count for FGG256] |
| Analog Peripherals | — | [DATA_NEEDED: ADC channel count and resolution] |
| On-chip RTC / POR | — | [DATA_NEEDED: RTC/POR availability details] |