A3PE600-2FG256I vs M7AFS600-2FGG256I 비교
다음의 상세 나란히 비교: A3PE600-2FG256I 제조: Microchip Technology 및 M7AFS600-2FGG256I 제조: Microchip Technology. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Microchip Technology
M7AFS600-2FGG256I - 600K Gate Fusion Mixed-Signal FPGA | Microchip
M7AFS600-2FGG256I ✓ 활성사양 비교
| 파라미터 | A3PE600-2FG256I | M7AFS600-2FGG256I |
|---|---|---|
| 브랜드 | Microchip Technology | Microchip Technology |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $26.40 | $389.60 |
| Family | ProASIC3E (Flash FPGA) | Fusion Mixed-Signal FPGA (Actel/Microchip) |
| System Gates | 600000 gates | 600000 |
| Logic Elements (VersaTiles) | [DATA_NEEDED: number of VersaTiles] | — |
| Number of I/O | 165 | — |
| Embedded Memory (RAM bits) | 110592 bits | — |
| Maximum System Frequency | 310 MHz | — |
| Speed Grade | -2 | -2 |
| Core Voltage | 1.5 V | — |
| Process Technology | 130 nm | 130 nm, 7-layer metal, flash-based CMOS |
| Configuration Technology | Flash (non-volatile, single-chip) | — |
| 동작 온도 | -40C to +85C (industrial) | 0 to 70 C |
| 패키지 | 256-LBGA / FBGA (FG256) | 256-LBGA (FBGA-256), 1.0 mm ball pitch |
| Package Height | 1.80 mm | — |
| 실장 유형 | Surface Mount | Surface Mount |
| RoHS 상태 | RoHS Non-Compliant (contains lead, per distributor data) | — |
| Lead Free Status | Contains Lead | — |
| Total Cost of Ownership Feature | Low TOC, single-chip solution, reprogrammable | — |
| User I/O | — | 119 |
| Flash Memory Blocks | — | 110592 bits |
| Processor Support | — | ARM CoreMP7 |
| System Performance | — | 350 MHz |
| 공급 전압 | — | 1.5 V (core) |
| Logic Family | — | CMOS |
| Configuration | — | Nonvolatile flash, retains program when powered off, Live at Power-Up (LAPU) |
| Number of Pins/Balls | — | 256 |
| Packaging | — | Tray |