A3PE600-2FGG256 vs M1AFS600-1FGG256 비교
다음의 상세 나란히 비교: A3PE600-2FGG256 제조: Microchip Technology 및 M1AFS600-1FGG256 제조: Microchip Technology. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Microchip Technology
A3PE600-2FGG256 - ProASIC3E Flash FPGA 600K Gates | Microchip
A3PE600-2FGG256 ✓ 활성Microchip Technology
M1AFS600-1FGG256 - Fusion FPGA, Cortex-M1, 600K Gates | Microchip
M1AFS600-1FGG256 ✓ 활성사양 비교
| 파라미터 | A3PE600-2FGG256 | M1AFS600-1FGG256 |
|---|---|---|
| 브랜드 | Microchip Technology | Microchip Technology |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $33.15 | $191.10 |
| Family | ProASIC3E Flash FPGA | Fusion Mixed-Signal FPGA |
| System Gates | 600000 | 600000 |
| Logic Elements (CLBs) | 13824 | — |
| Maximum System Frequency | 310 MHz | — |
| Process Technology | 130 nm CMOS | 130 nm CMOS, flash-based |
| Core Voltage | 1.5 V | — |
| Number of User I/O | 165 | — |
| Configuration Memory | On-chip Flash (non-volatile, single-chip) | Flash (non-volatile, live at power-up) |
| Speed Grade | -2 | — |
| 패키지 | 256-LBGA (FGG256) | 256-ball LBGA (FGG256), 17x17x1.7 mm |
| 실장 유형 | Surface Mount | Surface Mount |
| Reprogrammability | In-system reprogrammable | — |
| 동작 온도 | [DATA_NEEDED: operating temperature range] | 0C to +85C |
| Embedded SRAM | [DATA_NEEDED: total embedded SRAM capacity] | — |
| I/O Standards | [DATA_NEEDED: supported I/O standards list] | — |
| RoHS 상태 | Compliant | Compliant |
| Supply Voltage Class | 1.5 V core / 3.3 V I/O class | — |
| Processor Core | — | ARM Cortex-M1 (hard core) |
| Configurable Logic Blocks (CLBs) | — | 13824 |
| Flip-Flops | — | 110592 |
| User I/O | — | 119 |
| Core Supply Voltage | — | 1.5 V |
| Analog Features | — | Configurable analog blocks, clock generation and management |
| Packaging | — | Tray |