EP20K600CF672I8ES vs EP20K600CF672C8N 비교
다음의 상세 나란히 비교: EP20K600CF672I8ES 제조: Intel 및 EP20K600CF672C8N 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EP20K600CF672I8ES | EP20K600CF672C8N |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 최종 구매 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $365.00 | $108.00 |
| Family | APEX 20KC | APEX 20KC |
| Logic Elements | 24,320 | — |
| Typical Gates | 600,000 | — |
| Maximum User I/O | 508 | — |
| Embedded Memory Bits | 311,296 | — |
| Process Technology | 0.18 µm CMOS (0.15 µm base) | — |
| Core Supply Voltage | 1.8 V | — |
| Maximum Internal Frequency | 301.21 MHz | — |
| PLLs (Phase-Locked Loops) | 4 | — |
| Configuration Scheme | FPP / PS | — |
| 패키지 | 672-ball FC-FBGA (FineLine) | BGA-652, 45 x 45 mm, 1.27 mm pitch |
| 동작 온도 | -40 °C to +85 °C (Industrial, I-grade) | 0°C to 85°C |
| Speed Grade | 8 | — |
| 실장 유형 | Surface Mount | Surface mount |
| RoHS 상태 | [DATA_NEEDED: RoHS compliance] | unknown |
| 메모리 유형 | SRAM-based (volatile, requires configuration) | — |
| Device Type | — | SPLD |
| Product Type | — | FPGA / programmable logic device |
| Nominal Gate Capacity | — | 600K gates |
| Logic Elements or Cells | — | 24,320 |
| Macros | — | 2,432 |
| User I/O Count | — | 508 |
| Package Terminals | — | 652 pins |
| Package Description | — | 672-pin FC-FBGA |
| 공급 전압 | — | 1.8 V |
| Listed Frequency | — | 301.21 MHz |
| Propagation Delay | — | 1.48 ns |
| Fabrication Process | — | 0.15 µm |
| Interconnect Metal | — | All-layer copper metal |
| I/O Configuration | — | 508 user I/O |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | unknown |
| Configuration Method | — | [DATA_NEEDED: configuration memory and programming method] |
| Core Current | — | [DATA_NEEDED: core supply current] |
| I/O Bank Voltage | — | [DATA_NEEDED: supported I/O voltage range] |
| Junction Temperature | — | [DATA_NEEDED: maximum junction temperature] |
| 열 저항 | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |