EP2A15F672C7AA vs EP2A15F672C7N 비교
다음의 상세 나란히 비교: EP2A15F672C7AA 제조: Intel 및 EP2A15F672C7N 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EP2A15F672C7AA | EP2A15F672C7N |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 최종 구매 | Obsolete |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $215.00 | $171.00 |
| Family | APEX II | APEX II |
| Typical Gates | 600K | — |
| Maximum System Gates | 1.4M | — |
| Logic Elements (LEs) | 16,640 | — |
| Maximum User I/O | 492 | — |
| Operating Frequency (internal) | 500 MHz | — |
| LVDS Data Rate | 1 Gbps True-LVDS | Up to 1 Gbps (True-LVDS) |
| Core Voltage | 1.5 V | 1.5 V |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, PCI-X, SSTL, HSTL, LVDS, LVPECL, PCML, HyperTransport | LVTTL, LVCMOS, SSTL, HSTL, LVDS, LVPECL |
| MultiVolt I/O Bank Voltages | 1.5V / 1.8V / 2.5V / 3.3V | — |
| Embedded Memory | Dual-port RAM blocks + CAM blocks | — |
| PLLs | 4 enhanced PLLs | — |
| 패키지 | 672-ball FC-FBGA (flip-chip) | 672-ball FC-FBGA (FineLine BGA) |
| Process Technology | 0.15 micrometer all-layer copper (up to 8 metal layers) | 0.15 µm all-layer copper CMOS |
| Programming Interfaces | Passive Serial, Fast Passive Parallel, JTAG (IEEE 1149.1) | — |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Lifecycle | Last-Time-Buy / EOL announced Nov-Dec 2016 | — |
| RoHS 상태 | Compliant (per Full-Electronic listing) | [DATA_NEEDED: RoHS status] |
| Logic Elements (Cells) | — | 16,640 |
| Embedded Memory Bits | — | 425,984 |
| User I/Os | — | 492 |
| Metal Layers | — | Up to 8 |
| Maximum Internal Frequency | — | 500 MHz |
| Speed Grade | — | -7 |
| 동작 온도 | — | Commercial (0C to +85C) |
| Configuration Methods | — | JTAG, Passive Serial |
| 실장 유형 | — | Surface Mount (BGA) |