EP2AGX260EF29I5N vs EP2AGX260EF29C5G 비교
다음의 상세 나란히 비교: EP2AGX260EF29I5N 제조: Intel 및 EP2AGX260EF29C5G 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EP2AGX260EF29I5N | EP2AGX260EF29C5G |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | Obsolete | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $1,950.00 | $2,515.00 |
| Series | Arria II GX | — |
| Family | Arria II | Arria II GX |
| Logic Elements | 244,188 | — |
| Adaptive Logic Modules (ALMs) | 10260 LABs | — |
| Embedded Memory Bits | 12,038,144 bits | — |
| Maximum User I/O | 372 | — |
| Number of I/O | 372 | — |
| Number of Transceivers | 12 | — |
| Transceiver Data Rate (CPLL) | up to 3.75 Gbps | — |
| Transceiver Data Rate (Channel PLL) | up to 5 Gbps | — |
| 18x18 Multipliers | 1,152 | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Speed Grade | 5 | C5 (commercial -5C to 85C) |
| Package Type | 780-BBGA, FCBGA (Flip-Chip BGA) | — |
| Package Dimensions | 29 mm x 29 mm | — |
| 실장 유형 | Surface Mount | Surface Mount |
| MSL 레벨 | [DATA_NEEDED: MSL level] | [DATA_NEEDED] |
| Lead Free | Yes | — |
| RoHS 상태 | Compliant | — |
| Process Technology | CMOS | — |
| Configuration | JTAG / passive serial / fast passive parallel | — |
| Logic Elements (LE) | — | 260,000 |
| Total Memory Bits | — | 12,038,144 bits |
| Embedded RAM Bits | — | 244,188 bits |
| Number of LABs | — | 10,260 |
| User I/O Count | — | 372 |
| 패키지 | — | 780-ball FBGA (FineLine BGA) |
| Package Code | — | HBGA, 29 mm |
| Process Node | — | 40 nm |
| Supply Voltage - Core | — | [DATA_NEEDED: VCCINT nominal] |
| Transceivers | — | Multi-gigabit transceivers (MGTs), count [DATA_NEEDED] |
| DSP Blocks | — | 18x18 multipliers, count [DATA_NEEDED] |
| 동작 온도 | — | 0C to 85C (commercial) |
| Lead-Free / RoHS | — | Yes (G suffix) |