EP2SGX130GF1508I5N vs EP2SGX90EF1152I5N 비교
다음의 상세 나란히 비교: EP2SGX130GF1508I5N 제조: Intel 및 EP2SGX90EF1152I5N 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Intel
EP2SGX130GF1508I5N - 132K LEs Stratix II GX FPGA 1.2V 1508-FCBGA | Intel
EP2SGX130GF1508I5N NrndIntel
EP2SGX90EF1152I5N - 90k LEs Stratix II GX FPGA 1.2V FC-FBGA-1152 | Intel
EP2SGX90EF1152I5N Obsolete사양 비교
| 파라미터 | EP2SGX130GF1508I5N | EP2SGX90EF1152I5N |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | NRND | Obsolete |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $372.00 | $1,320.00 |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements (LEs) | 132,540 | 90,960 |
| Equivalent Logic Cells | 132,540 | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.2 V nominal (1.15 V to 1.25 V) | — |
| Maximum Internal Frequency | 717 MHz | — |
| 최대 클록 주파수 | 622.08 MHz | 609.76 MHz |
| Logic Family | CMOS | — |
| 동작 온도 범위 | -40C to +85C (Industrial) | — |
| 패키지 | 1508-ball FCBGA (Flip-Chip BGA), 40 x 40 mm, 1.0 mm pitch | — |
| 실장 유형 | Surface Mount | Surface Mount |
| Number of Pins / Balls | 1508 | — |
| Speed Grade | I5 | — |
| RoHS 상태 | Lead-free (per package code MS-034AAU-1) | [DATA_NEEDED: RoHS status] |
| MSL 레벨 | [DATA_NEEDED: MSL rating] | — |
| Series | — | EP2SGX90 |
| Equivalent CLBs | — | 90,960 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Combinatorial Delay | — | 4.006 ns |
| Package Type | — | FC-FBGA (flip-chip fine-pitch BGA) |
| Number of Pins/Balls | — | 1152 |
| Package Code | — | BGA |
| Package Shape | — | SQUARE |
| Terminal Form | — | BALL |
| Operating Temperature Grade | — | INDUSTRIAL (I) |
| Embedded Transceivers | — | Yes (GX series, multi-gigabit PMA) |
| On-chip Block Memory | — | [DATA_NEEDED: total M512/M4K/M-RAM bits] |
| DSP Blocks | — | [DATA_NEEDED: number of DSP blocks] |
| User I/O Banks | — | [DATA_NEEDED: I/O bank count] |