EP3C40F780C6N vs EP3C40F780C8 비교
다음의 상세 나란히 비교: EP3C40F780C6N 제조: Intel 및 EP3C40F780C8 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EP3C40F780C6N | EP3C40F780C8 |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | NRND | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $172.00 | $99.95 |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 39,600 | 39,600 |
| Embedded Memory Bits | 1,161,216 | — |
| Embedded Memory (Kbytes) | 113 | — |
| M9K Memory Blocks | 126 | — |
| Logic Array Blocks (LABs) | 4,065 | — |
| Maximum User I/O Pins | 535 | 535 |
| PLLs | 4 | — |
| Process Technology | 60 nm CMOS | 65 nm low-power CMOS |
| Core Voltage | 1.2 V | — |
| Speed Grade | 6 (commercial) | C8 (commercial, -40C to +85C operating range per 'C' designator family convention) |
| 동작 온도 | 0C to +85C (commercial) | — |
| 패키지 | 780-ball FBGA (FineLine BGA) | 780-ball FBGA (FineLine BGA) |
| Package Dimensions | 29 x 29 mm | — |
| Ball Pitch | 1.0 mm | — |
| Package Height | 2.6 mm | — |
| 실장 유형 | Surface Mount (FBGA) | Surface Mount (BGA) |
| Lead Free | Yes | — |
| Configuration Method | SRAM, JTAG via USB-Blaster | — |
| RoHS 상태 | Compliant | Compliant |
| Series | — | EP3C40 |
| Total Memory Bits | — | 1,161,216 bits (1134 Kbit) |
| Embedded Memory | — | M9K blocks, 486 Kbit total (per family datasheet) |
| Embedded 18x18 Multipliers | — | 126 |
| General Purpose PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| User I/O Banks | — | [DATA_NEEDED: user I/O bank count] |
| Supported Memory Interfaces | — | DDR, DDR2, QDRII SRAM (via dedicated PHY) |
| Configuration | — | Serial (AS) / Parallel (AP) / JTAG |