EP3SE110F780I4L vs EP3SE110F780I3N 비교
다음의 상세 나란히 비교: EP3SE110F780I4L 제조: Intel 및 EP3SE110F780I3N 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Intel
EP3SE110F780I3N - 107.5K Logic Elements, 780-FBGA FPGA | Intel Stratix III E
EP3SE110F780I3N Nrnd사양 비교
| 파라미터 | EP3SE110F780I4L | EP3SE110F780I3N |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | NRND | NRND |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $1,395.00 | $1,950.00 |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 107,500 | 107,500 |
| LABs (Logic Array Blocks) | 4,300 | — |
| User I/Os | 488 | — |
| Embedded Memory | 8,936,448 bits (8.9 Mbit) | — |
| Maximum Operating Frequency | 375 MHz | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Core Voltage | 0.9 V | 1.1 V (range 1.05 V to 1.15 V) |
| 패키지 | 780-pin FC-FBGA (Flip-Chip BGA) | 780-pin FC-FBGA (Flip-Chip FineLine BGA) |
| Package Body Size | 29 mm × 29 mm | — |
| Ball Pitch | 1.0 mm | — |
| Operating Temperature (Industrial) | -40 °C to +100 °C | — |
| 실장 유형 | Surface Mount (FC-FBGA) | Surface Mount (BGA) |
| RoHS 상태 | Compliant (per legacy Altera data) | Compliant |
| Product Status | Not Recommended for New Designs (NRND) | — |
| Logic Array Blocks (LABs) | — | 4,300 |
| Embedded Memory Bits | — | 8,936,448 (approximately 1.1 MB) |
| Maximum User I/Os | — | 488 |
| 동작 온도 | — | -40 °C to +100 °C (Industrial, "I" grade) |
| Configuration Interface | — | Passive Serial (PS), Fast Passive Parallel (FPP), JTAG (IEEE 1149.1) |
| Boundary-Scan Test | — | Yes, per IEEE Std. 1149.1 |
| Speed Grade | — | 3 (Fast) |
| PLLs | — | Yes, with global and regional clock networks |
| MSL 레벨 | — | [DATA_NEEDED: MSL level] |
| Supply Voltage Tolerance | — | 1.05 V to 1.15 V |