EP3SE260F1152I3G vs EP3SE260F1152C3 비교
다음의 상세 나란히 비교: EP3SE260F1152I3G 제조: Intel 및 EP3SE260F1152C3 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EP3SE260F1152I3G | EP3SE260F1152C3 |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | NRND | 최종 구매 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $1,240.00 | $12,500.00 |
| Series | Stratix III E | Stratix III E |
| Family | Stratix III | — |
| Logic Elements (LE) | 255,000 | — |
| Embedded Memory Bits | 16,672,640 bits | — |
| Embedded Memory Bits (alternate) | 20,880 Kb (16,672,640 / 1024) | — |
| User I/O Count | 744 | — |
| 패키지 | 1152-BBGA, FCBGA (FineLine BGA) | 1152-ball FCBGA (Flip-Chip BGA) |
| 동작 온도 범위 | -40C to +100C (Industrial) | — |
| Speed Grade | I3 (Industrial, balanced) | C3 |
| Process Technology | 40 nm TSMC low-power | 40 nm |
| Supply Voltage Core | 0.9 V (typical, see handbook) | — |
| Configuration Bitstream Encryption | AES-256 (Stratix III feature) | — |
| I/O Standards Supported | LVDS, LVPECL, HSTL, SSTL, LVCMOS, PCI, PCI-X | — |
| 실장 유형 | Surface Mount (BGA) | Surface Mount |
| RoHS 상태 | [DATA_NEEDED: RoHS compliance not stated in scraped data] | Compliant |
| 습도 민감도 레벨 (MSL) | [DATA_NEEDED: MSL rating per JEDEC J-STD-020] | — |
| Lead-Free Reflow | [DATA_NEEDED: peak reflow temperature] | — |
| Design Toolchain | Quartus II / Quartus Prime | — |
| Country of Origin / Distribution | Multiple authorized distributors (DigiKey, Mouser) | — |
| Logic Elements | — | 255,000 |
| Embedded Memory (bits) | — | 16,672,768 |
| Logic Array Blocks (LABs) | — | 10,200 |
| User I/Os | — | 744 |
| Embedded 18x18 Multipliers | — | 384 |
| Core Voltage | — | 0.9 V to 1.1 V |
| 동작 온도 | — | 0C to +85C (Commercial) |
| Configuration Method | — | Passive Serial / Fast Passive Parallel / JTAG |
| PLLs | — | 12 |