EP4CGX75DF27C8N vs EP4CGX75DF27I8N 비교
다음의 상세 나란히 비교: EP4CGX75DF27C8N 제조: Intel 및 EP4CGX75DF27I8N 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EP4CGX75DF27C8N | EP4CGX75DF27I8N |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $117.11 | $89.95 |
| Device Family | Cyclone IV GX | — |
| Logic Elements (LE) | 73,920 | — |
| Logic Array Blocks (LAB) | 4,605 | — |
| Embedded Memory | 4,257,792 bits (approx. 532 Kbits RAM) | 310 Kbits (M9K blocks) + 414 Kbits (M144K blocks) per datasheet, see [DATA_NEEDED: exact total] |
| Embedded 18x18 Multipliers | 274 | — |
| User I/O Pins | 310 | 310 |
| High-Speed Transceivers | Up to 8 channels, 3.125 Gbps | — |
| PLLs | 4 | [DATA_NEEDED: PLL count] |
| Global Clock Networks | 20 | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 60 nm low-power CMOS | 60 nm low-power CMOS |
| 패키지 | 672-ball FBGA (F27) | 672-ball FBGA (F27) |
| Operating Temperature (Commercial) | 0C to +85C | — |
| 실장 유형 | Surface Mount | — |
| Configuration Method | SRAM-based, requires external config device | — |
| PCIe Hard IP | PCIe Gen1 x1/x2/x4 endpoint | — |
| RoHS 상태 | Compliant | [DATA_NEEDED: confirm from datasheet] |
| Lead-Free / Halogen-Free | Yes / [DATA_NEEDED: halogen free status] | — |
| Family | — | Cyclone IV GX |
| Logic Elements | — | 73,920 |
| Total Memory Bits | — | 4,257,792 |
| Transceiver Channels | — | 8 |
| Max Transceiver Data Rate | — | 3.125 Gbps |
| 동작 온도 | — | -40C to +100C (Industrial, I-suffix) |
| Multipliers (18x18) | — | [DATA_NEEDED: 18x18 multiplier count] |
| Hard IP | — | PCIe Gen1, memory controller |
| Configuration Interface | — | JTAG, serial, passive parallel |
| MSL 레벨 | — | [DATA_NEEDED: moisture sensitivity level] |