EPF10K200EFC672-3 vs EPF10K250EFC672-3 비교
다음의 상세 나란히 비교: EPF10K200EFC672-3 제조: Intel 및 EPF10K250EFC672-3 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Intel
EPF10K200EFC672-3 - FLEX 10KE FPGA 9984 Cells 470 I/O BGA-672 | Intel
EPF10K200EFC672-3 Obsolete
사양 비교
| 파라미터 | EPF10K200EFC672-3 | EPF10K250EFC672-3 |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | Obsolete | Obsolete |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $115.00 | $99.50 |
| Series | FLEX 10KE | — |
| Number of Logic Elements / Cells | 9,984 | — |
| Number of LABs / CLBs | 1248 | — |
| Total RAM Bits | 98,304 bits (12 EABs of 8 Kbits) | — |
| Number of I/O | 470 | — |
| Number of Gates (typical) | 200,000 | — |
| Supply Voltage - Operating | 2.3 V to 2.7 V (2.5 V nominal) | — |
| Process Technology | 0.22 µm CMOS | 0.25 um CMOS, 5-layer metal |
| Maximum Operating Frequency | 166.67 MHz | — |
| Propagation Delay | 0.4 ns | — |
| 패키지 / 케이스 | 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA) | — |
| 실장 유형 | Surface Mount | Surface Mount |
| 동작 온도 | 0 °C to +70 °C (commercial) | — |
| Configuration Memory | SRAM-based (volatile, requires external configuration device) | — |
| Number of PLLs | 4 | — |
| RoHS 상태 | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS status - 672-FBGA part is non-RoHS per Fly-Wing listing] |
| MSL 레벨 | [DATA_NEEDED: MSL level] | — |
| Lead-Free | [DATA_NEEDED: lead-free status] | [DATA_NEEDED: lead-free status] |
| Product Type | — | FPGA (Field Programmable Gate Array) |
| Family | — | FLEX 10KE |
| Maximum Typical Gates | — | 250,000 |
| Logic Elements (LEs) | — | 12,160 |
| Embedded Memory (EAB) | — | 655,360 bits (80 EABs x 2,048 bits each) |
| Logic Array Blocks (LABs) | — | 392 (8 LEs per LAB) |
| User I/O Pins | — | 470 |
| Core Supply Voltage | — | 2.5 V |
| I/O Supply Voltage | — | MultiVolt: 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Speed Grade | — | -3 (fastest) |
| Temperature Grade | — | Commercial (0C to +70C) |
| 패키지 | — | 672-ball FineLine BGA (FC) |
| Ball Pitch | — | 1.0 mm |
| Configuration Mode | — | JTAG (IEEE 1149.1) ISP / serial / parallel, external EPCx PROM |