LPC1311FHN33,551 vs LPC1316FHN33,551 비교
다음의 상세 나란히 비교: LPC1311FHN33,551 제조: NXP Semiconductors 및 LPC1316FHN33,551 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | LPC1311FHN33,551 | LPC1316FHN33,551 |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $1.24 | $0.82 |
| Core Processor | ARM Cortex-M3 | ARM Cortex-M3 |
| Core Size | 32-Bit | 32-Bit |
| Max CPU Frequency | 72 MHz | 72 MHz |
| Flash Memory | 8 KB (8K x 8) | 48 KB (48K x 8) |
| SRAM | 2 KB | — |
| Supply Voltage Range | 2 V to 3.6 V | 2.5 V to 3.3 V |
| I/O Pins | 25 GPIO (up to 28 on family) | — |
| Communication Interfaces | I2C (Fast-mode plus), UART | — |
| Timers | 4 x General Purpose Timers | — |
| Package Type | HVQFN-33 (7 x 7 mm, 0.85 mm height) | — |
| 실장 유형 | Surface Mount | Surface Mount |
| 동작 온도 | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Life Cycle Stage | ACTIVE | — |
| Data Converters | [DATA_NEEDED: ADC specification] | — |
| Program Memory Type | FLASH | — |
| RoHS 상태 | Compliant (per NXP standard product offering) | — |
| Supplier Device Package | 32-HVQFN (7x7) | — |
| SRAM Size | — | [DATA_NEEDED: SRAM size] |
| 패키지 | — | 32-HVQFN (7x7 mm) Exposed Pad |
| Series | — | LPC13xx (LPC1316) |
| USB Controller | — | USB device |
| Serial Interfaces | — | USART |
| Pipeline | — | 3-stage |
| Architecture | — | Harvard, with separate instruction and data buses |
| EEPROM Emulation | — | Yes (per LPC1316 family datasheet) |
| Packaging | — | Tray |