LPC55S28JBD64K vs LPC55S26JBD64Y 비교
다음의 상세 나란히 비교: LPC55S28JBD64K 제조: NXP Semiconductors 및 LPC55S26JBD64Y 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | LPC55S28JBD64K | LPC55S26JBD64Y |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $3.60 | $0.00 |
| Core Processor | ARM Cortex-M33 (Armv8-M mainline) | ARM Cortex-M33 |
| Core Size | 32-bit | 32-Bit |
| 최대 클록 주파수 | 150 MHz | 150 MHz |
| Flash Memory | 512 KB | — |
| SRAM | 104 KB | — |
| 공급 전압 | 3.3 V (1.8 V to 3.6 V range) | 3.3 V |
| Security Features | TrustZone, secure boot (S variant) | — |
| Peripherals | Flexcomm serial interfaces, USB full-speed device, dual 12-bit ADC, timers/PWM, DMA | — |
| Connectivity | UART, SPI, I2C, I2S via Flexcomm | — |
| Number of I/O | [DATA_NEEDED: Number of GPIO pins] | — |
| 동작 온도 | [DATA_NEEDED: Operating temperature range] | — |
| 패키지 | 64-HTQFP (10x10 mm) with exposed pad | 64-HTQFP (10 x 10 mm), exposed pad |
| 실장 유형 | Surface Mount | Surface Mount (Gull Wing terminals) |
| Process Technology | 40-nm NVM | 40-nm NVM |
| Product Family | LPC55S2x (LPC5500 Series, EdgeVerse platform) | — |
| Program Memory Type | FLASH | — |
| Data Converters | Dual 12-bit ADC | — |
| RoHS 상태 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Program Flash Memory | — | 256 KB (256K x 8) |
| Temperature Grade | — | Industrial |
| Product Series | — | LPC552x / LPC55S2x |
| Number of Terminals | — | 64 |
| Package Shape | — | Square |
| SRAM Size | — | [DATA_NEEDED: SRAM size] |
| 동작 온도 범위 | — | [DATA_NEEDED: operating temperature range] |
| Peripheral Compatibility | — | Pin-, software- and peripheral-compatible with LPC552x/S2x family |