M1AFS250-1FG256I vs M1AFS250-2FG256I 비교
다음의 상세 나란히 비교: M1AFS250-1FG256I 제조: Microchip Technology 및 M1AFS250-2FG256I 제조: Microchip Technology. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Microchip Technology
M1AFS250-1FG256I - 250K Gate Fusion FPGA, 114 I/O | Microchip
M1AFS250-1FG256I ✓ 활성Microchip Technology
M1AFS250-2FG256I - 250K Gate Fusion FPGA, ARM M1 | Microchip
M1AFS250-2FG256I ✓ 활성사양 비교
| 파라미터 | M1AFS250-1FG256I | M1AFS250-2FG256I |
|---|---|---|
| 브랜드 | Microchip Technology | Microchip Technology |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $96.50 | $0.00 |
| Series | Fusion (M1 - with ARM Cortex-M1) | — |
| System Gates | 250000 gates | 250K |
| D Flip-Flops (DFF) | 36864 | — |
| Total I/O | 114 | — |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) | 1.5 V |
| Configuration Type | Flash-based (live at power-up) | — |
| Embedded Processor | ARM Cortex-M1 soft core | — |
| Analog Features | Configurable analog blocks, clock generation and management | — |
| On-chip Memory | Flash memory blocks | — |
| 동작 온도 | -40C to +85C (industrial, suffix I) | — |
| Speed Grade | -1 | -2 |
| 패키지 | 256-LBGA (FBGA) | 256-ball FBGA (256-LBGA) |
| Package Dimensions | 17 mm x 17 mm x 1.2 mm height | — |
| 실장 유형 | Surface Mount | Surface Mount |
| Supplier Device Package | 256-LBGA | — |
| Total RAM | [DATA_NEEDED: Total RAM bits] | — |
| Embedded Block RAM (eSRAM) | [DATA_NEEDED: eSRAM size] | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Family | — | Fusion (M1AFS, ARM Cortex-M1 support) |
| User I/O | — | 114 |
| Embedded RAM Bits | — | 36864 |
| Process Technology | — | 130 nm, 7-layer metal flash-based CMOS |
| System Performance | — | 350 MHz |
| Processor Core | — | ARM Cortex-M1 (hard IP) |
| Configuration Memory | — | Flash-based, nonvolatile |
| Power-Up Mode | — | Live at Power-Up (LAPU) |
| Analog Block | — | Configurable analog (voltage, current, temperature monitoring) |
| Temperature Range | — | Industrial (-40C to +85C) |
| RoHS 상태 | — | RoHS Non-Compliant (contains lead; FGG variant is lead-free) |
| Packaging | — | Tray |