M1AFS250-2FGG256I vs M1AFS250-FGG256 비교
다음의 상세 나란히 비교: M1AFS250-2FGG256I 제조: Microchip Technology 및 M1AFS250-FGG256 제조: Microchip Technology. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Microchip Technology
M1AFS250-2FGG256I - Fusion FPGA 250K Gates ARM Cortex-M1 | Microchip
M1AFS250-2FGG256I ✓ 활성Microchip Technology
M1AFS250-FGG256 - 250K-Gate Fusion Mixed-Signal FPGA | Microchip
M1AFS250-FGG256 ✓ 활성사양 비교
| 파라미터 | M1AFS250-2FGG256I | M1AFS250-FGG256 |
|---|---|---|
| 브랜드 | Microchip Technology | Microchip Technology |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $83.12 | $88.00 |
| Family | Actel Fusion (Mixed-Signal FPGA) | Fusion (M1 series, mixed-signal FPGA) |
| System Gates | 250000 gates | 250,000 |
| Registers (DFFs) | 36864 | — |
| User I/Os | 114 | — |
| Embedded Processor | ARM Cortex-M1 | ARM Cortex-M1 (M1 variants) |
| Configuration Technology | Flash-based, nonvolatile | — |
| Process Technology | 130 nm, 7-layer metal CMOS | — |
| System Performance | Up to 350 MHz | — |
| Speed Grade | -2 | — |
| Core Supply Voltage | 1.5 V | — |
| 패키지 | 256-ball FBGA (FGG256) | 256-LBGA (FGG256), 1.0 mm ball pitch |
| 실장 유형 | Surface Mount | Surface Mount |
| 동작 온도 | -40C to +85C (industrial, I grade) | [DATA_NEEDED: operating temperature range] |
| Security | 128-bit Flash lock, AES decryption | — |
| Power-Up Behavior | Live at Power-Up (LAPU) | — |
| RoHS 상태 | Compliant (FGG = Pb-free balls) | RoHS Compliant |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Logic Cells | — | 6144 |
| User I/O | — | 114 |
| 최대 클록 주파수 | — | 350 MHz |
| Configuration Memory | — | Flash-based, live at power-up |
| Flash Memory Bits | — | 36864 |
| Technology | — | CMOS |
| Lead Free Status | — | Lead Free |
| 공급 전압 | — | [DATA_NEEDED: core supply voltage] |
| Analog Peripherals | — | Configurable analog (voltage/temperature monitoring) |
| Clock Management | — | On-chip clock generation and management circuitry |