M1AFS600-1FGG256 vs M1AFS250-1FGG256I 비교

다음의 상세 나란히 비교: M1AFS600-1FGG256 제조: Microchip Technology 및 M1AFS250-1FGG256I 제조: Microchip Technology. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

Microchip Technology
M1AFS600-1FGG256 M1AFS600-1FGG256 - Fusion FPGA, Cortex-M1, 600K Gates | Microchip

M1AFS600-1FGG256 - Fusion FPGA, Cortex-M1, 600K Gates | Microchip

M1AFS600-1FGG256 ✓ 활성
Microchip Technology
M1AFS250-1FGG256I M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip

M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip

M1AFS250-1FGG256I ✓ 활성

사양 비교

파라미터 M1AFS600-1FGG256 M1AFS250-1FGG256I
브랜드 Microchip Technology Microchip Technology
카테고리 FPGA & CPLD FPGA & CPLD
수명 주기 상태 활성 활성
재고 상태 In Stock In Stock
단가 (USD) $191.10 $0.00
Family Fusion Mixed-Signal FPGA —
Processor Core ARM Cortex-M1 (hard core) ARM Cortex-M1 (optional ARM support, M1 variant)
System Gates 600000 250,000 gates
Configurable Logic Blocks (CLBs) 13824 —
Flip-Flops 110592 —
User I/O 119 —
Core Supply Voltage 1.5 V —
Process Technology 130 nm CMOS, flash-based —
Configuration Memory Flash (non-volatile, live at power-up) Nonvolatile flash (Live at Power-Up, LAPU)
동작 온도 0C to +85C —
패키지 256-ball LBGA (FGG256), 17x17x1.7 mm —
실장 유형 Surface Mount —
Analog Features Configurable analog blocks, clock generation and management —
RoHS 상태 Compliant [DATA_NEEDED: RoHS status]
Packaging Tray Tray
Series — M1AFS250 (Fusion)
Logic Cells — 6144
Total SRAM/Flip-Flop Bits (DigiKey listing) — 36864
Number of I/O — 114
Maximum System Frequency — 350 MHz
Technology — 130-nm, 7-layer metal, flash-based CMOS
Security — 128-bit flash-based lock, AES decryption
동작 공급 전압 — 1.5 V
Minimum Operating Temperature — -40 C
Maximum Operating Temperature — +85 C
패키지 / 케이스 — 256-LBGA (FBGA), 1.00 mm ball pitch
장착 스타일 — SMD/SMT
Mixed-Signal Features — Configurable analog, flash memory blocks, clock generation and management
Moisture Sensitivity Level — [DATA_NEEDED: MSL level]

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