M7AFS600-2FGG256 vs M7AFS600-2FGG256I 비교
다음의 상세 나란히 비교: M7AFS600-2FGG256 제조: Microchip Technology 및 M7AFS600-2FGG256I 제조: Microchip Technology. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Microchip Technology
M7AFS600-2FGG256 - 600K Gate Fusion FPGA with ARM | Microchip
M7AFS600-2FGG256 ✓ 활성Microchip Technology
M7AFS600-2FGG256I - 600K Gate Fusion Mixed-Signal FPGA | Microchip
M7AFS600-2FGG256I ✓ 활성사양 비교
| 파라미터 | M7AFS600-2FGG256 | M7AFS600-2FGG256I |
|---|---|---|
| 브랜드 | Microchip Technology | Microchip Technology |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $274.05 | $389.60 |
| Family | Fusion Mixed-Signal FPGA | Fusion Mixed-Signal FPGA (Actel/Microchip) |
| System Gates | 600K | 600000 |
| Processor Core | ARM CoreMP7 | — |
| User I/O | 119 | 119 |
| Dedicated Logic Bits | 110592 bits | — |
| Speed Grade | -2 | -2 |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) | — |
| Technology | 130 nm flash-based | — |
| Configuration | Flash-based (nonvolatile, instant-on) | Nonvolatile flash, retains program when powered off, Live at Power-Up (LAPU) |
| 패키지 | 256-LBGA (FBGA-256, 17x17 mm) | 256-LBGA (FBGA-256), 1.0 mm ball pitch |
| 실장 유형 | Surface Mount (SMD/SMT) | Surface Mount |
| 동작 온도 | 0C to +70C | 0 to 70 C |
| Packaging | Tray | Tray |
| Manufacturer Standard Lead Time | 16 Weeks (per Mouser, as of 2026-09-02) | — |
| Programmable Type | In-System Programmable (ISP) | — |
| Supplier Device Package | 256-FBGA | — |
| Flash Memory Blocks | — | 110592 bits |
| Processor Support | — | ARM CoreMP7 |
| Process Technology | — | 130 nm, 7-layer metal, flash-based CMOS |
| System Performance | — | 350 MHz |
| 공급 전압 | — | 1.5 V (core) |
| Logic Family | — | CMOS |
| Number of Pins/Balls | — | 256 |