M7AFS600-FG256I vs AFS600-1FGG256 비교
다음의 상세 나란히 비교: M7AFS600-FG256I 제조: Microchip Technology 및 AFS600-1FGG256 제조: Microchip Technology. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | M7AFS600-FG256I | AFS600-1FGG256 |
|---|---|---|
| 브랜드 | Microchip Technology | Microchip Technology |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| Series | M7AFS600 (Fusion) | — |
| System Gates | 600K | 600,000 gates |
| Logic Capacity (DigiKey listing) | 110592 | — |
| Number of I/O | 119 I/O | — |
| Embedded Processor | ARM CoreMP7 | — |
| Core Supply Voltage | 1.5 V | — |
| Process Technology | 130 nm | 130 nm CMOS |
| 패키지 / 케이스 | 256-LBGA (FBGA) | — |
| Terminal Form | Ball | — |
| Package Shape | Square | — |
| 장착 스타일 | SMD/SMT | — |
| Minimum Operating Temperature | -40 C | — |
| Maximum Operating Temperature | +85 C | — |
| Packaging | Tray | — |
| Programmable Logic Type | Flash-based, non-volatile | — |
| Analog Integration | Mixed-signal (configurable analog + flash memory) | — |
| User I/O | — | 119 I/O |
| 공급 전압 | — | 1.5 V |
| Logic Family | — | Flash-based CMOS |
| Metal Layers | — | 7 layers |
| Package Type | — | 256-ball FBGA |
| Package Pin Count | — | 256 balls |
| Package Pitch | — | 1.0 mm |
| 동작 온도 | — | 0°C to 70°C |
| Configuration Memory | — | Embedded nonvolatile flash |
| Power-Up Configuration | — | Live at power-up |
| Integrated Analog Resources | — | Configurable analog blocks |
| Integrated Clock Management | — | Clock generation and management |
| Embedded Memory | — | Large flash memory blocks |
| Package Family | — | FBGA surface-mount package family |
| RoHS 상태 | — | RoHS compliant |
| Lead-Free Status | — | Lead-free |
| Pin Assignments | — | [DATA_NEEDED: complete AFS600-1FGG256 pin assignments] |
| Maximum Operating Frequency | — | [DATA_NEEDED: maximum operating frequency] |