M7AFS600-FG256I vs AFS600-FG256 비교

다음의 상세 나란히 비교: M7AFS600-FG256I 제조: Microchip Technology 및 AFS600-FG256 제조: Microchip Technology. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

Microchip Technology
M7AFS600-FG256I M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-FG256I ✓ 활성
Microchip Technology
AFS600-FG256 AFS600-FG256 - 600K Mixed-Signal Fusion FPGA | Microchip

AFS600-FG256 - 600K Mixed-Signal Fusion FPGA | Microchip

AFS600-FG256 ✓ 활성

사양 비교

파라미터 M7AFS600-FG256I AFS600-FG256
브랜드 Microchip Technology Microchip Technology
카테고리 FPGA & CPLD FPGA & CPLD
수명 주기 상태 활성 활성
Series M7AFS600 (Fusion) —
System Gates 600K 600,000 gates
Logic Capacity (DigiKey listing) 110592 —
Number of I/O 119 I/O —
Embedded Processor ARM CoreMP7 —
Core Supply Voltage 1.5 V —
Process Technology 130 nm 130 nm
패키지 / 케이스 256-LBGA (FBGA) —
Terminal Form Ball —
Package Shape Square —
장착 스타일 SMD/SMT —
Minimum Operating Temperature -40 C —
Maximum Operating Temperature +85 C —
Packaging Tray —
Programmable Logic Type Flash-based, non-volatile —
Analog Integration Mixed-signal (configurable analog + flash memory) —
Product Type — Fusion mixed-signal FPGA
User I/O Count — 119 I/Os
Embedded Memory — 110,592 bits
공급 전압 — 1.5 V
Logic Family — CMOS
Metal Layers — 7 layers
Configuration Memory — Nonvolatile flash-based CMOS
Power-Up Behavior — Live at Power-Up (LAPU)
Package Type — 256-pin low-profile BGA
Package Pitch — 1.0 mm
핀 수 — 256 pins
동작 온도 — 0 C to 70 C
Device Type — FPGA
Analog Capability — Configurable analog blocks
Clock Capability — Integrated clock generation and management circuitry
Maximum Frequency — 1098.9 MHz
RoHS 상태 — [DATA_NEEDED: RoHS status]
REACH Status — [DATA_NEEDED: REACH status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification status]

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