MC9S08AW32CFGE vs MC9S08AW60CFGE 비교
다음의 상세 나란히 비교: MC9S08AW32CFGE 제조: NXP Semiconductors 및 MC9S08AW60CFGE 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | MC9S08AW32CFGE | MC9S08AW60CFGE |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | NRND | NRND |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $2.86 | $0.00 |
| Core Processor | S08 (HCS08) 8-bit CISC | S08 (HCS08) 8-bit CISC |
| Core Size | 8-bit | 8-Bit |
| Maximum CPU Frequency | 40 MHz | 40 MHz |
| Internal Bus Frequency | 20 MHz | 20 MHz |
| Flash Memory | 32 KB (32K x 8) | 60 KB (60K x 8) |
| RAM | 2 KB | — |
| EEPROM | [DATA_NEEDED: EEPROM size] | — |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| ADC Resolution | 10-bit | 10-bit, 8-channel |
| ADC Channels | 8-channel | — |
| General Purpose I/O | 34 | — |
| 패키지 | 44-LQFP (10x10 mm), 0.5 mm pitch | 44-LQFP (10x10 mm), 0.50 mm pitch, MO-220VKKD-2 |
| Package Standard | MO-220VKKD-2, 7 x 7 mm body variants per distributor listing | — |
| 실장 유형 | Surface Mount | Surface Mount |
| Debug Interface | Single-wire background debug mode (BDM) | Single-wire background debug mode (BDM) |
| Instruction Set | HC08 instruction set with added BGND instruction | HC08 instruction set with added BGND instruction |
| 동작 온도 | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| 수명 주기 상태 | NRND (Not Recommended for New Designs) | NRND (Not Recommended for New Designs) per NXP |
| RoHS 상태 | [DATA_NEEDED: RoHS status] | — |
| RAM Size | — | [DATA_NEEDED: RAM size] (Mouser listing states 4K; FindIC overview states 2K) |
| I/O Count | — | 38 general-purpose I/O |
| Supply Voltage Nominal | — | 3.3 V / 5 V |
| Packaging | — | Tray |
| Family | — | MC9S08AW (S08AW series) |