MC9S08AW60CPUE vs MC9S08AW60MPUE557 비교
다음의 상세 나란히 비교: MC9S08AW60CPUE 제조: NXP Semiconductors 및 MC9S08AW60MPUE557 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
NXP Semiconductors
MC9S08AW60MPUE557 - 8-bit HCS08 MCU 60KB Flash 40MHz LQFP-64
MC9S08AW60MPUE557 ✓ 활성사양 비교
| 파라미터 | MC9S08AW60CPUE | MC9S08AW60MPUE557 |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $0.00 | $6.10 |
| Core Processor | S08 (HCS08) | — |
| Core Size | 8-Bit | — |
| Speed (CPU Clock) | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | 20 MHz |
| Flash Memory | 60 KB (60K x 8) | — |
| RAM Size | 4 KB | — |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| I/O Count | 38 | — |
| Peripherals | 16-bit timer, ADC, SCI, SPI, multiple power-saving modes | — |
| ADC | 10-bit | [DATA_NEEDED: number of channels and resolution] |
| Instruction Set | HC08 (CISC) with added BGND instruction | — |
| Debug Interface | Single-wire background debug mode (BDM) | Single-wire Background Debug Mode (BDM) |
| 패키지 | 64-LQFP (10 x 10 mm, 0.5 mm pitch, MO-220VKKD-2, 1 mm height) | 64-LQFP (10x10 mm) |
| 실장 유형 | Surface Mount | Surface Mount |
| 동작 온도 | [DATA_NEEDED: Operating Temperature Range] | [DATA_NEEDED: operating temperature range] |
| Life Cycle Stage | Active | — |
| Programmable Memory Type | Flash | — |
| Family | HCS08 (S08AW) | — |
| Core Architecture | — | HCS08 (enhanced S08) |
| 데이터 버스 폭 | — | 8-bit |
| CPU Clock Speed | — | 40 MHz |
| Program Memory (Flash) | — | 60 KB (60K x 8) |
| RAM | — | 4 KB |
| 동작 공급 전압 | — | 2.7 V to 5.5 V |
| I/O Pins | — | 38 (per digchip datasheet); 64 programmable I/O lines per microchipusa |
| PWM Channels | — | [DATA_NEEDED: PWM channel count] |
| Serial Interfaces | — | SCI, SPI, I2C (per NXP family description) |
| RoHS 상태 | — | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |