MC9S08DZ32AMLH vs S9S08DV16F2MLC 비교
다음의 상세 나란히 비교: MC9S08DZ32AMLH 제조: NXP Semiconductors 및 S9S08DV16F2MLC 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | MC9S08DZ32AMLH | S9S08DV16F2MLC |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | NRND | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $0.00 | $2.10 |
| Core Processor | HCS08 (S08 core) | S08 (HCS08), 8-bit CISC |
| Core Size | 8-Bit | 8-bit |
| Instruction Set | HC08 with added BGND instruction (CISC) | — |
| Maximum CPU Frequency | 40 MHz | — |
| Bus Frequency | 20 MHz | — |
| Program Memory Size | 32KB (32K x 8) FLASH | — |
| 공급 전압 | 3.3V / 5V | — |
| ADC Resolution | 12 bit | 12-bit |
| ADC Channels | 24-channel | — |
| ADC Conversion Time | 2.5 us | — |
| CAN Module | Yes (embedded CAN, MSCAN) | — |
| EEPROM | Embedded EEPROM | Embedded EEPROM emulation supported (family feature) |
| Interrupt/Reset Sources | Up to 32 | — |
| Debug Interface | On-chip emulation/debug (background debug, BGND) | — |
| 패키지 | 64-LQFP (10x10 mm) | 32-LQFP (7x7 mm) |
| 실장 유형 | Surface Mount | Surface Mount |
| Packaging | Tray | Tray |
| Series | S08DZ (S08 Family, S08D Series) | S9S08DV16 |
| Product Category | Microcontrollers (MCU) | — |
| 수명 주기 상태 | NRND (Not Recommended for New Designs) | — |
| 최대 클록 주파수 | — | 40 MHz |
| Flash Memory | — | 16 KB (16K x 8) |
| RAM Size | — | 2 KB |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| 동작 온도 | — | -40C to +125C |
| Automotive Qualification | — | AEC-Q100 qualified |
| Connectivity | — | CAN, Serial (per family datasheet) |
| Data Programmers | — | On-chip emulation / background debug (BDM) |
| RoHS 상태 | — | [DATA_NEEDED: RoHS compliance status] |