MC9S12B256MFUE vs MC9S12GC32MFUE 비교

다음의 상세 나란히 비교: MC9S12B256MFUE 제조: NXP Semiconductors 및 MC9S12GC32MFUE 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

NXP Semiconductors
MC9S12B256MFUE MC9S12B256MFUE - 16-bit HCS12 MCU, 256KB Flash | NXP

MC9S12B256MFUE - 16-bit HCS12 MCU, 256KB Flash | NXP

MC9S12B256MFUE Nrnd
NXP Semiconductors
MC9S12GC32MFUE MC9S12GC32MFUE - HCS12 16-Bit MCU 32KB Flash | NXP | 80-QFP

MC9S12GC32MFUE - HCS12 16-Bit MCU 32KB Flash | NXP | 80-QFP

MC9S12GC32MFUE ✓ 활성

사양 비교

파라미터 MC9S12B256MFUE MC9S12GC32MFUE
브랜드 NXP Semiconductors NXP Semiconductors
카테고리 Microcontrollers Microcontrollers
수명 주기 상태 NRND 활성
재고 상태 In Stock In Stock
단가 (USD) $21.60 $6.10
Core HCS12 (16-bit CISC) HCS12 (CPU12)
CPU Family S12B (MC9S12B series) —
Maximum CPU Clock 25 MHz —
Program Memory (Flash) 256 KB (256K x 8) —
RAM 12 KB —
EEPROM 4 KB —
공급 전압 2.35 V to 5.5 V —
ADC 10-bit, 8-channel —
PWM Module 8-channel, 8-bit —
CAN (msCAN) 1 x CAN 2.0A/B —
SCI / SPI / I2C Yes (1 each) —
Enhanced Capture Timer 6 x 16-bit channels —
동작 온도 -40 C to +125 C (junction) [DATA_NEEDED: operating temperature range]
패키지 80-QFP, 14 x 14 mm, 1.0 mm pitch 80-QFP (PQFP, 14x14 mm)
실장 유형 Surface Mount Surface Mount
MSL 레벨 3 (168 hours) [DATA_NEEDED: MSL level]
RoHS 상태 Compliant Compliant
Debug Interface BDM (Background Debug Mode) —
Lifecycle NRND (Not Recommended for New Designs) —
Core Size — 16-Bit
Core Architecture — CISC
Program Memory Size — 32 KB (32K x 8) Flash
RAM Size — 2 KB (2K x 8)
EEPROM Size — [DATA_NEEDED: EEPROM size]
Maximum Bus Frequency — 25 MHz (PLL up to 50 MHz)
Supply Voltage Range — 2.5 V / 5 V (2.97 V to 5.5 V external supply)
Number of I/O — 60
Connectivity — EBI/EMI, SCI, SPI
Peripherals — POR, PWM, WDT
Series — S12GC

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