MC9S12XDT512MAL vs MC9S12XDP512VAL 비교
다음의 상세 나란히 비교: MC9S12XDT512MAL 제조: NXP Semiconductors 및 MC9S12XDP512VAL 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
NXP Semiconductors
MC9S12XDT512MAL - 16-bit HCS12X MCU 512KB Flash 80MHz LQFP-112 | NXP
MC9S12XDT512MAL Nrnd
사양 비교
| 파라미터 | MC9S12XDT512MAL | MC9S12XDP512VAL |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | NRND | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $14.20 | $11.10 |
| Core Processor | HCS12X | HCS12X |
| Core Size | 16-bit | — |
| Core Architecture | CISC | 16-bit CISC |
| Maximum CPU Speed | 80 MHz | — |
| Program Memory | 512 KB Flash | — |
| RAM | 20 KB | — |
| 공급 전압 | 2.5 V / 5 V | 2.35 V to 2.75 V |
| Connectivity | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | — |
| Peripherals | LVD, POR, PWM, WDT | — |
| Number of I/O | [DATA_NEEDED: number of I/O pins] | — |
| ADC | 8/10-bit (channels [DATA_NEEDED]) | 8/10-bit ATD (S12ATD10B8CV3) |
| Package Type | 112-LQFP (20x20 mm) | 112-pin LQFP (20 x 20 mm) |
| 실장 유형 | Surface Mount | Surface Mount |
| 동작 온도 | -40C to +125C | [DATA_NEEDED: automotive -40C to +105C or -40C to +125C grade] |
| Series | MC9S12 / S12XD | — |
| Process Technology | TSMC3 (automotive qualified) | — |
| Boundary-Scan Debug | BDM + JTAG/Nexus | — |
| RoHS 상태 | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS compliance] |
| Lifecycle | NRND (Not Recommended for New Designs) | — |
| Maximum CPU Frequency | — | 80 MHz |
| Program Memory Size | — | 512 KB (512K x 8) Flash |
| RAM Size | — | [DATA_NEEDED: RAM size in KB] |
| EEPROM Size | — | [DATA_NEEDED: EEPROM emulation size] |
| I/O Pins | — | 119 |
| CAN Modules | — | Multiple MSCAN (CAN 2.0A/B) |
| Co-processor | — | XGATE |
| Instruction Set Compatibility | — | Upward-compatible with HCS12 |
| ROM Type | — | Flash |
| 수명 주기 상태 | — | Active |