MPC860DECZQ50D4 vs MPC860DEZQ50D4 비교
다음의 상세 나란히 비교: MPC860DECZQ50D4 제조: NXP Semiconductors 및 MPC860DEZQ50D4 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | MPC860DECZQ50D4 | MPC860DEZQ50D4 |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | 최종 구매 | NRND |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $15.20 | $24.95 |
| Core Processor | MPC8xx PowerQUICC, 32-bit Power Architecture | — |
| Number of Cores | 1 | — |
| Bus Width | 32-bit | — |
| Core Speed | 50 MHz | — |
| Co-Processors / DSP | Communications; CPM (Communications Processor Module) | — |
| RAM Controllers | DRAM | — |
| On-Chip Cache | 4 KB instruction + 4 KB data | — |
| MMU | Yes (integrated, with translation tables) | — |
| Ethernet | 2x 10 Mbps MAC (MII) | — |
| Serial Communications Controllers (SCC) | 4 | — |
| Serial Management Controllers (SMC) | 2 | — |
| DMA Channels | 4 | — |
| 공급 전압 | 3.3 V (core 2.2 V, I/O 3.3 V) | — |
| 동작 온도 | -40 C to +95 C | 0 C to +95 C |
| 패키지 | 357-PBGA, 25x25 mm | 357-Ball PBGA (25x25 mm) |
| 실장 유형 | Surface Mount (BGA) | Surface Mount (BGA) |
| Lead Status | Contains Lead | — |
| RoHS 상태 | Non-Compliant (legacy BGA with lead-bearing solder balls) | Contains Lead (legacy BGA) |
| Packaging | Tray (D4 suffix) | Tray |
| Processor Type | — | MPC8xx PowerQUICC, 32-bit |
| Core Architecture | — | Power Architecture (embedded) |
| Core Frequency | — | 50 MHz |
| Communications Processor Module | — | CPM with HDLC, Ethernet, PCMCIA, SCC |
| Ethernet MAC | — | 10/100 Mbps integrated |
| HDLC/SDLC Channels | — | Yes (multi-channel) |
| PCMCIA Interface | — | Yes |
| Supply Voltage (I/O) | — | 3.3 V |
| Lead-Free Status | — | Contains Lead |
| Sub-Brand Heritage | — | Freescale / NXP PowerQUICC |