MPC870ZT66 vs MPC875ZT66 비교
다음의 상세 나란히 비교: MPC870ZT66 제조: NXP Semiconductors 및 MPC875ZT66 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | MPC870ZT66 | MPC875ZT66 |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | 최종 구매 | 수명 종료 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Part Number | MPC870ZT66 | — |
| Family | PowerQUICC MPC8xx | — |
| Core Architecture | Power Architecture, 32-bit | — |
| CPU Core Count | 1 | — |
| Maximum CPU Clock | 66 MHz | — |
| 공급 전압 | 3.3 V | 3.3 V |
| 동작 온도 | 0 C to +95 C | — |
| 패키지 | 256-PBGA (23x23 mm) | — |
| 실장 유형 | Surface Mount | — |
| Tray Packaging | Tray (per FindIC description) | — |
| Process Technology | 0.18 um | 0.18 µm |
| On-chip Memory | Dual-port RAM (size not specified in data) | — |
| Ethernet Controllers | 10/100 Mbps Fast Ethernet (FEC) | — |
| Serial Interfaces | HDLC, PCMCIA, I2C, SPI | — |
| Memory Controller | DRAM, SRAM, ROM, Flash | — |
| Lifecycle | End of Life / Last Time Buy per NXP page | — |
| Processor Type | — | MPC8xx communications processor |
| Architecture | — | Power Architecture |
| Core Count | — | 1 core |
| Data Width | — | 32-bit |
| 최대 클록 주파수 | — | 66 MHz |
| 동작 온도 범위 | — | 0 °C to 95 °C |
| Package Type | — | 256-pin PBGA (23 mm x 23 mm) |
| Package Code | — | HBGA |
| Terminal Count | — | 256 |
| Package Shape | — | Square |
| Peak Reflow Temperature | — | 245 °C |
| Application Category | — | Networking and communications applications |
| RoHS 상태 | — | [DATA_NEEDED: RoHS status] |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification status] |
| Lead-Free Status | — | [DATA_NEEDED: lead-free status] |
| Halogen-Free Status | — | [DATA_NEEDED: halogen-free status] |
| Pinout | — | [DATA_NEEDED: complete numbered pinout] |