MPC880ZP66 vs MPC880ZP80 비교
다음의 상세 나란히 비교: MPC880ZP66 제조: NXP Semiconductors 및 MPC880ZP80 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | MPC880ZP66 | MPC880ZP80 |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | Obsolete | Obsolete |
| Processor Type | MPC8xx PowerQUICC communications microprocessor | — |
| Architecture | Power Architecture | — |
| Core Count | 1 core | — |
| Data Width | 32 bit | — |
| 최대 클록 주파수 | 66 MHz | — |
| 공급 전압 | 3.3 V | — |
| 동작 온도 범위 | 0 C to 95 C | [DATA_NEEDED: operating temperature range] |
| Package Type | 357-PBGA (25 x 25 mm) | — |
| Package Pin Count | 357 pins | — |
| 실장 유형 | Surface mount | Surface Mount |
| Packaging | Tray | — |
| RoHS 상태 | RoHS | — |
| Lead-Free Status | Contains Lead | — |
| Output Current | [DATA_NEEDED: processor output current specification] | — |
| Internal Memory | [DATA_NEEDED: internal memory configuration] | — |
| External Memory Interface | [DATA_NEEDED: external memory interface details] | — |
| Communications Peripherals | [DATA_NEEDED: communications peripheral list] | — |
| Maximum Power Dissipation | [DATA_NEEDED: maximum power dissipation] | — |
| 열 저항 | [DATA_NEEDED: junction-to-ambient thermal resistance] | — |
| 공급 전류 | [DATA_NEEDED: operating supply current] | — |
| Core Architecture | — | PowerPC (MPC8xx family) |
| 데이터 버스 폭 | — | 32-bit |
| Maximum Core Frequency | — | 80 MHz |
| Number of Cores | — | 1 |
| Instruction Cache | — | 4 KB |
| Data Cache | — | 4 KB |
| Ethernet MACs | — | 2 (10/100 Mbps Fast Ethernet Controller) |
| USB Interface | — | USB 1.1 (host + slave) |
| Serial Communications Controllers (SCC) | — | 2 (per datasheet family) |
| Serial Management Controllers (SMC) | — | 2 (per datasheet family) |
| PCMCIA Controller | — | Yes (2 ports) |
| Memory Controller | — | DRAM/Flash/SRAM, 32-bit |
| Operating Voltage - Core | — | [DATA_NEEDED: core voltage] |
| Operating Voltage - I/O | — | 3.3 V |
| 패키지 | — | 357-PBGA (25x25 mm) |
| Process Technology | — | CMOS |
| Lead Free / RoHS | — | [DATA_NEEDED: RoHS status] |
| MSL 레벨 | — | [DATA_NEEDED: MSL level] |
| Lifecycle | — | Obsolete (Rochester Electronics stocking) |