MPX2100A vs MPXC2012DT1 비교

다음의 상세 나란히 비교: MPX2100A 제조: NXP Semiconductors 및 MPXC2012DT1 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

NXP Semiconductors
MPX2100A MPX2100A - 100kPa Absolute Pressure Sensor, 40mV | NXP Semiconductors

MPX2100A - 100kPa Absolute Pressure Sensor, 40mV | NXP Semiconductors

MPX2100A ⚠ 최종 구매

사양 비교

파라미터 MPX2100A MPXC2012DT1
브랜드 NXP Semiconductors NXP Semiconductors
카테고리 Pressure Sensors Pressure Sensors
수명 주기 상태 최종 구매 NRND
재고 상태 In Stock In Stock
단가 (USD) $7.94 $7.40
Pressure Type Absolute Differential
Operating Pressure Range 0 kPa to 100 kPa (0 psi to 14.5 psi) —
Maximum Overpressure [DATA_NEEDED: maximum overpressure rating] —
출력 유형 Analog Voltage (ratiometric) Wheatstone Bridge (analog mV)
출력 전압 범위 0 mV to 40 mV (typical full-scale span) —
Full-Scale Span 40 mV (typical at 10 V supply) —
Offset (Offset Null) 0 mV nominal —
공급 전압 10 V typical (recommended operating) —
공급 전류 6 mA typical —
Sensitivity 0.4 mV/kPa (at 10 V supply) —
Linearity ±0.25% (best-fit straight line) [DATA_NEEDED: linearity %FS]
Pressure Hysteresis ±0.1% (full-scale span) —
Temperature Hysteresis ±1.0% (full-scale span) —
동작 온도 -40°C to +125°C [DATA_NEEDED: operating temperature range]
Compensated Temperature 0°C to +85°C —
패키지 4-SIP Module (UNIBODY) —
Port Configuration Single axial port (Port 1) —
실장 유형 Through-Hole Through-hole, vertical
Sensing Technology Silicon piezoresistive (MEMS) —
Min. Package Quantity 25 —
Min. Order Quantity 125 —
RoHS 상태 [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS compliance status]
Operating Pressure — 1.45 PSI (10 kPa)
Maximum Over Pressure — [DATA_NEEDED: maximum overpressure rating]
Full-Scale Output — 24 mV to 26 mV (typ. 25 mV) at 10 V excitation
Offset (Null) — 0 mV nominal at 10 V excitation
Excitation Voltage — 10 V DC typical
Bridge Resistance — [DATA_NEEDED: input/output bridge resistance]
Pressure Port Size — Female, 0.128 in (3.25 mm) side port
Port Style — Side port, single barbed inlet
패키지 / 케이스 — 4-SSIP Module (chip-pak, no gel)
Termination Style — Through-hole PCB (vertical mount)
Gel Protection — No (bare die in chip-pak cavity)
Storage Temperature — [DATA_NEEDED: storage temperature range]
MSL 레벨 — Not applicable (through-hole sensor module)
Manufacturer — NXP Semiconductors (formerly Freescale / Motorola)

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