MSC8254SAG1000B vs MSC8256ESAG1000B 비교
다음의 상세 나란히 비교: MSC8254SAG1000B 제조: NXP Semiconductors 및 MSC8256ESAG1000B 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | MSC8254SAG1000B | MSC8256ESAG1000B |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | Microcontrollers | DSP |
| 수명 주기 상태 | 최종 구매 | 최종 구매 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $122.00 | $198.75 |
| Product Type | Multi-core Digital Signal Processor (DSP) | — |
| Core Architecture | StarCore SC3850 (4 cores) | StarCore SC3850 VLIW DSP |
| Number of Cores | 4 | 6 |
| Core Clock Frequency | 1 GHz | — |
| L1 Instruction Cache (per core) | 32 KB | — |
| L1 Data Cache (per core) | 32 KB | — |
| Unified L2 Cache | 512 KB (configurable as M2 in 64 KB increments) | — |
| Memory Management Unit | Yes (MMU) | — |
| Interrupt Controller | Extended Programmable Interrupt Controller (EPIC) | — |
| DDR Memory Controller | DDR2/DDR3 with ECC | — |
| Gigabit Ethernet Interfaces | 2 | — |
| Serial RapidIO (SRIO) Ports | 2 | — |
| PCI Express Interfaces | 2 | — |
| QUICC Engine Subsystem | Yes | — |
| 패키지 | 783-FCPBGA (29x29 mm) | 783-FCPBGA (29x29 mm) |
| Process Technology | 45 nm | — |
| 동작 온도 | 0C to 105C | 0°C to 105°C |
| RoHS 상태 | Compliant | Compliant |
| Core Frequency | — | 1 GHz |
| DDR Memory Interface | — | DDR2/DDR3 with ECC |
| Serial RapidIO | — | SRIO (peripheral) |
| PCI Express | — | PCIe (peripheral) |
| Gigabit Ethernet | — | GbE MACs (peripheral) |
| Security Engine | — | SEC (IPsec/SRTP/SSL) |
| Queue Engine | — | QE (peripheral) |
| 실장 유형 | — | Surface Mount, BGA |
| MSL 레벨 | — | 3 |
| Peak Reflow Temperature | — | 245°C (JEDEC J-STD-020) |
| Terminal Finish | — | Tin Silver Copper (e1, JESD-609) |
| TDM Links | — | Up to 4 independent, 62.5 Mbps each |