NX3225GA-CC vs NX3225GA-12MHZ-STD-CRG-1 비교
다음의 상세 나란히 비교: NX3225GA-CC 제조: NDK 및 NX3225GA-12MHZ-STD-CRG-1 제조: NDK. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | NX3225GA-CC | NX3225GA-12MHZ-STD-CRG-1 |
|---|---|---|
| 브랜드 | NDK | NDK |
| 카테고리 | Crystals & Resonators | Crystals & Resonators |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $0.20 | $0.20 |
| Product Type | Quartz Crystal Unit (AT-cut, fundamental mode) | — |
| Series | NX3225GA | — |
| Frequency Range | 9.8 MHz to 50 MHz (fundamental) | — |
| Frequency Tolerance (+25 C) | +/-20 x 10-6 max (ppm) | — |
| Frequency Stability (-40 to +85 C) | +/-40 x 10-6 max (ppm) | — |
| Reference Temperature | +25 C | — |
| Equivalent Series Resistance (9.8-12 MHz) | 200 ohm max | — |
| Equivalent Series Resistance (12-13 MHz) | 100 ohm max | — |
| Equivalent Series Resistance (13-20 MHz) | 80 ohm max | — |
| Equivalent Series Resistance (20-50 MHz) | 50 ohm max | — |
| Package Size | 3.2 x 2.5 x 0.75 mm typ. | 3.2 x 2.5 x 0.75 mm typ. (SMD3225-4P) |
| Package Type | 4-SMD, No Lead (ceramic, 3225) | — |
| 실장 유형 | Surface Mount | Surface Mount |
| Soldering | Lead-free reflow profile compatible | — |
| RoHS 상태 | Compliant | Compliant |
| Environmental Characteristics | Heat and shock resistant, stable start-up | — |
| Nominal Frequency (this order code) | [DATA_NEEDED: nominal frequency (MHz)] | — |
| Load Capacitance (this order code) | [DATA_NEEDED: load capacitance (pF)] | — |
| Operating Temperature (this order code) | [DATA_NEEDED: operating temperature range] | — |
| Drive Level | [DATA_NEEDED: drive level (uW)] | 100 uW typ. |
| Shunt Capacitance (this order code) | [DATA_NEEDED: shunt capacitance C0 (pF)] | — |
| Nominal Frequency | — | 12 MHz |
| Frequency Tolerance | — | ±20 ppm at 25 C |
| Load Capacitance | — | 8 pF |
| Equivalent Series Resistance (ESR) | — | 100 ohm max |
| Aging / Frequency Stability Class | — | ±30 ppm |
| 동작 온도 범위 | — | -10 C to +70 C |
| Storage Temperature Range | — | -40 C to +125 C |
| Number of Pads | — | 4 |
| Terminal Finish | — | Tungsten metallization, Au plating over Ni pre-plating |
| Reflow Soldering | — | Suitable (per manufacturer profile) |
| Application Segment | — | OA (office automation) / AV (audiovisual) equipment |
| Vibration Mode | — | Fundamental mode |