STM32H753IIT6 vs STM32H755ZIT6 비교
다음의 상세 나란히 비교: STM32H753IIT6 제조: STMicroelectronics 및 STM32H755ZIT6 제조: STMicroelectronics. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
STMicroelectronics
STM32H755ZIT6 - Dual-Core Cortex-M7/M4 MCU, 2MB Flash | STMicroelectronics
STM32H755ZIT6 ✓ 활성사양 비교
| 파라미터 | STM32H753IIT6 | STM32H755ZIT6 |
|---|---|---|
| 브랜드 | STMicroelectronics | STMicroelectronics |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $9.45 | $16.19 |
| Core | ARM Cortex-M7 with DP-FPU and DSP | — |
| Maximum CPU Frequency | 480 MHz | — |
| DMIPS | 1027 DMIPS | — |
| CoreMark Score | 2424 CoreMark | — |
| Program Memory (Flash) | 2 MB | — |
| SRAM | 1 MB (256 KB DTCM + 256 KB AXI SRAM + 64 KB ITCM + backup SRAM) | 1 MB (DTCM + AXI + SRAM1/2/3) |
| L1 Cache | 16 KB I-cache + 16 KB D-cache | — |
| Operating Voltage | 1.62 V to 3.6 V (3.3 V typical I/O) | — |
| 패키지 | 176-pin LQFP (24x24 mm) | LQFP-144 (20x20 mm) |
| 실장 유형 | Surface Mount | Surface Mount |
| 동작 온도 | -40 C to +85 C (industrial grade) | -40 °C to +85 °C (industrial grade) |
| MSL 레벨 | 3 (168 hours) | 3 (per JEDEC J-STD-020) |
| RoHS 상태 | Compliant | Compliant |
| ADC | 3 x 12-bit, 3.6 MSPS each | 3 x 16-bit, up to 3.6 MSPS |
| DAC | 2 x 12-bit | 2 x 12-bit |
| Communication Interfaces | USB OTG FS+HS, 2x CAN FD, 2x SDMMC, UART, SPI, I2C, ETH, FMC | Ethernet, USB OTG HS/FS, 2x CAN FD, 6x SPI, 4x I2C, USART/UART, SDMMC, SAI |
| Hardware Accelerators | JPEG codec, AES-256, SHA-256, TRNG, Chrom-ART (DMA2D) | — |
| Display Interface | TFT-LCD + MIPI-DSI | — |
| Camera Interface | DCMI 8- to 14-bit parallel | — |
| Core Architecture | — | Dual-core Arm Cortex-M7 + Cortex-M4 |
| Cortex-M7 Max Frequency | — | 480 MHz |
| Cortex-M4 Max Frequency | — | 240 MHz |
| Flash Memory | — | 2 MB (dual-bank) |
| GPIO Count | — | 114 |
| Supply Voltage VDD | — | 1.62 V to 3.6 V |
| Graphics | — | Chrom-ART Accelerator, LCD-TFT controller, JPEG codec |
| Crypto Accelerators | — | AES, SHA, RSA, TRNG |
| Internal SMPS | — | Yes (step-down for core) |
| Process Node | — | 40 nm CMOS |