XC6SLX75-3FG676I vs XC6SLX75-3FG676C 비교

다음의 상세 나란히 비교: XC6SLX75-3FG676I 제조: AMD 및 XC6SLX75-3FG676C 제조: AMD. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

AMD
XC6SLX75-3FG676C XC6SLX75-3FG676C - 74,637-Cell Spartan-6 LX FPGA

XC6SLX75-3FG676C - 74,637-Cell Spartan-6 LX FPGA

XC6SLX75-3FG676C ✓ 활성

사양 비교

파라미터 XC6SLX75-3FG676I XC6SLX75-3FG676C
브랜드 AMD AMD
카테고리 FPGA & CPLD FPGA & CPLD
수명 주기 상태 Unknown 활성
재고 상태 In Stock In Stock
단가 (USD) $0.00 $0.00
Device Type Field Programmable Gate Array (FPGA) FPGA
FPGA Family Spartan-6 LX —
Logic Cells 74,637 cells 74,637 cells
Configurable Logic Blocks 5,831 CLBs 5,831 CLBs
Maximum Frequency 862 MHz —
I/O Count 408 I/O —
Process Technology 45 nm CMOS 45 nm CMOS
패키지 676-ball FCBGA —
Package Body Size 27 mm x 27 mm —
Ball Pitch 1 mm 1.0 mm
Terminal Count 676 terminals 676 terminals
Temperature Grade Industrial —
Speed Grade -3 -3
Surface-Mount Type Ball Grid Array (BGA) —
Verified Distributor Price USD 67.1347 per unit —
LCSC Availability In stock —
RoHS 상태 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
REACH Status [DATA_NEEDED: REACH status] [DATA_NEEDED: REACH status]
Lead-Free Status [DATA_NEEDED: lead-free status] [DATA_NEEDED: lead-free status]
Automotive Qualification [DATA_NEEDED: AEC-Q100 qualification] —
Device Family — Spartan-6 LX
Internal Frequency — 667 MHz
공급 전압 — [DATA_NEEDED: supply voltage]
동작 온도 — 0°C to 85°C (32°F to 185°F)
Package Type — 676-BGA
Package Description — FBGA-676
Package Dimensions — 27 mm × 27 mm
Package Family — FBGA
실장 유형 — Surface mount
I/O Standard — [DATA_NEEDED: supported I/O standards]
Block RAM — [DATA_NEEDED: block RAM resources]
DSP Resources — [DATA_NEEDED: DSP resources]
Configuration Method — [DATA_NEEDED: configuration method]

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