Robotiq 2FC Launch Adds Tactile Intelligence for Robotic Handling
Robotiq's production-ready 2FC combines tactile sensing, local AI and upgrade paths for existing 2F grippers, with shipping planned for the first quarter of 2027.
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MasterGaN7 expands 650V GaN design options for power-conversion BOMs
STMicroelectronics added 650V, 6A MasterGaN7 devices with integrated drivers, higher switching capability and package compatibility for power-conversion designs.
ESP-Mosaico AI Coding Could Reshape Microcontroller Prototyping
ESP-Mosaico combines an ESP32-S31 development platform with AI workflows that generate, deploy and test firmware on physical hardware.
Getac B360X refresh raises design-in questions for rugged notebook buyers
Getac launched the B360X and B360X Pro with AI processing, 14-inch displays and expanded connectivity, giving field-computing buyers a new rugged-platform option.
WD Fiscal Q1 2027 Results: Storage Capacity and Sourcing Implications
WD reported 55% revenue growth and higher margins for fiscal Q1 2027, signaling sustained storage demand that buyers should assess against capacity and lead-time plans. [S1]
Over-$500M Gears of War: E-Day budget report raises publisher risk questions
TechPowerUp relays an insider claim that Gears of War: E-Day cost over $500 million to produce, raising questions about revenue recovery and studio staffing.
What VinFast’s U.S. electric-bus plan means for fleet sourcing
VinFast plans a service-based U.S. electric-bus offering with NexMove, including charging, maintenance and operations, with certified deliveries expected in 2028.
SAMA S32 WOOD bundles bring compact cases and 650 W or 850 W ATX 3.1 PSUs to US buyers
SAMA is offering the S32 WOOD compact microATX case with 650 W or 850 W 80 Plus Gold power supplies through Amazon US and Newegg US.
Micron 245TB SSD density reshapes data-center storage planning
Micron’s 245TB QLC SSD targets warm-tier workloads, but buyers must validate network throughput, cooling, indirection, workload fit, and availability.
·3 분 소요
NVIDIA books substrate, packaging and test capacity across Amkor, KYEC, SPIL and others: what it means for AI build-out lead times
NVIDIA pairs with seven partners to lift substrate output 2.5x, Amkor interposer wafer capacity over 300%, and double test capacity by 2027; ramps run into 2028.
ESP32-S3 Internet Radio Design Uses WiFi, OLED and Class-D Audio
A compact desktop internet radio combines an ESP32-S3, 1.3-inch OLED, rotary encoder and MAX98357 amplifier, offering a reference design for connected-audio products.
·3 분 소요
CapMetro deployment puts Camber pantograph charging on two Rapid bus routes
Two all-electric Austin bus routes now use Camber Charging systems, including 2.9 MW of depot capacity and overhead charging at both terminals.
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