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Three Spanish vineyards tested vertical and Venetian-blind PV arrays during the 2024 harvest, preserving grape yield while generating up to 555,905 kWh/ha annually.
Algerian 12 MW plant saw performance ratio slide from 85.37% to 78.74% in 2020 during COVID-19 maintenance gaps, recovering to 84.83% by 2023.
Two 50x26 mm boards - one CPU, one FPGA - drive 1920x1080 or 1366x768 panels over LVDS, eDP, DVI, or VGA for bare-metal embedded UIs.
Samsara's disposable Bluetooth Tracking Label, introduced in June, was named to TIME's Best Inventions 2026 in Logistics, signaling Bluetooth + IoT as a viable alternative to barcode-based shipment tracking for high-value electronics.
France plans to lift the 17 MW injection ceiling for hybrid PV-BESS projects up to 25 MW installed by end-2026, alongside smart-meter and heat-pump subsidy changes.
Intel said Razor Lake-AX will deliver 700 TOPS at INT8/FP8, 3.88x Panther Lake's 180 TOPS, using a Xe3 iGPU up to 32 cores and bringing back on-package LPDDR5X/LPDDR6 memory.
Infineon locks in multi-year 200mm SiC substrate supply from Wolfspeed, supporting its Kulim fab ramp and broadening multi-source sourcing for SiC power devices.
Bare-die photos of Nova Lake-HX and -H lay out a six-tile mobile package using TSMC N2P, Intel 3-E and Intel 18A-P nodes, with new core counts and package sizes.
TI rolls an AEC-Q200 50 MΩ divider rated to 2,000 V DC for EV battery management, underscoring how automotive specs now reshape passive-component sourcing.
dashdogy's Universal MFG Unlocker v1.5.0 enables NVIDIA's new Preset C on Ampere cards, but RTX 30 numbers and image-quality trade-offs remain unverified.
SP Industrial adds six 3D eTLC enterprise SSDs across E1.S, U.2, M.2 2280, and 2.5" SATA, with a 7.6 TB PCIe Gen5 E1.S and dual 1/3 DWPD endurance tiers.
A 3D InCites technical review of hybrid bonding defects, CMP, warpage, and annealing shows Applied Materials at 450nm pitch with 98% yield and imec at 200nm pitch on 300mm W2W.
